Abstract: The present disclosure provides a tamper-proofing electronic seal. The tamper-proofing electronic seal includes a shell, a lead seal rope, and a lead seal label. The lead seal label comprises a chip, an antenna circuit, a power supply, a power switch, and a potential detection circuit which are electrically connected. The power switch is arranged on a circuit, electrically connected to the chip, of the power supply. The potential detection circuit is electrically connected to the antenna circuit and the chip. A fixing hole and a locking hole are provided at positions, corresponding the potential detection circuit and the power switch, of the interior of the shell; the fixing end of the lead seal rope is clamped in the shell through the fixing hole; the use state of the electronic seal can be accurately marked, and the electronic seal is prevented from being tampered with or recycled.

Abstract: The utility model discloses a vehicle RFID tag comprising a first glue layer, IR/UV protective layers, an INLAY layer, a second glue layer and a print layer, and the first glue layer, the INLAY layer, the second glue layer and the print layer are sequentially arranged in a stacked mode; the INLAY layer comprises a fragile layer, an RFID antenna layer and an RFID chip, and the fragile layer, the RFID antenna layer and the RFID chip are sequentially arranged in a stacked mode; the areas of the IR/UV protective layers are larger than the area of the RFID chip, and the viscosity of the first glue layer is larger than that of the second glue layer. The utility model has the beneficial effects that the anti-dismantling function is achieved, and the RFID chip can be protected against damage caused by ultraviolet rays and infrared rays.

Abstract: The utility model discloses a vehicle RFID tag comprising a first glue layer, IR/UV protective layers, an INLAY layer, a second glue layer and a print layer, and the first glue layer, the INLAY layer, the second glue layer and the print layer are sequentially arranged in a stacked mode; the INLAY layer comprises a fragile layer, an RFID antenna layer and an RFID chip, and the fragile layer, the RFID antenna layer and the RFID chip are sequentially arranged in a stacked mode; the areas of the IR/UV protective layers are larger than the area of the RFID chip, and the viscosity of the first glue layer is larger than that of the second glue layer. The utility model has the beneficial effects that the anti-dismantling function is achieved, and the RFID chip can be protected against damage caused by ultraviolet rays and infrared rays.