Abstract: A light-emitting diode (LED) includes: a base having an upward-opening accommodating space; an LED chip disposed at the base, and arranged in the accommodating space; a packaging adhesive covering the LED chip; a lens disposed over the packaging adhesive, wherein: the lens has a first surface proximal to the packaging adhesive; the first surface has: a first subsurface at a center area with a substantially spherical or parabolic shape; a second subsurface with a substantially ring shape and surrounding the first subsurface and extending downward with an increasing diameter; a third subsurface with a substantially ring shape and surrounding the second subsurface, having a top ring edge and extending downward with a decreasing diameter; and a fourth subsurface with a substantially planar shape and surrounding the top ring edge of the third subsurface and connected with the base.
Type:
Grant
Filed:
September 30, 2018
Date of Patent:
November 10, 2020
Assignee:
XIAMENC SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Inventors:
Xing-Long Li, Chi-Wei Liao, Chen-Ke Hsu, Weng Tack Wong