Abstract: According to a specific embodiment of the present invention, a mask-less lithography method and apparatus is provided. The apparatus includes an integrated write head on a slider with an air bearing that creates a lift force that allows that write head to fly over a spinning wafer substrate in nanometer distance without physical contact. The short distance between the write head and substrate prevents the light from diffracting. As a result, micro and nanometer structures can be patterned without being limited by light diffraction in conventional lithography methods.