Abstract: The present invention relates to a precision measurement system using an interferometer and an image, comprising: an interferometer for measuring a distance to a movable object by a transfer device; an imaging device which is fixed at a specific position and captures an image of an object located within a specific range; and a control device which calculates absolute coordinates indicating a distance from a reference point to each pixel of the image on the basis of the distance measured by the interferometer and the image obtained by the imaging device, calculates an absolute distance between the pixels of the image on the basis of the absolute coordinates, and measures a length of the object captured by the imaging device using the absolute coordinates or the absolute distance.
Type:
Grant
Filed:
April 26, 2017
Date of Patent:
August 11, 2020
Assignee:
XL PHOTONICS, INC.
Inventors:
Heung Ro Choo, Jeong Eun Jeon, Min Soo Kim
Abstract: An optical module includes a substrate including an optical device chip disposed on a top surface thereof, a spacer having at least one through hole and combined with the substrate on the substrate to insert the optical device chip into the through hole, a cover combined with the spacer on the spacer to stop the through hole, and an optical fiber combined with the cover on the cover in a position corresponding to a position of the optical device chip. The optical module is configured such that light transmitted through the optical fiber is incident to the optical device chip or light emitted from the optical device chip is incident to the optical fiber. The optical module may be downscaled and produced in large quantities at low cost.
Abstract: An optical module includes a substrate including an optical device chip disposed on a top surface thereof, a spacer having at least one through hole and combined with the substrate on the substrate to insert the optical device chip into the through hole, a cover combined with the spacer on the spacer to stop the through hole, and an optical fiber combined with the cover on the cover in a position corresponding to a position of the optical device chip. The optical module is configured such that light transmitted through the optical fiber is incident to the optical device chip or light emitted from the optical device chip is incident to the optical fiber. The optical module may be downscaled and produced in large quantities at low cost.