Patents Assigned to XSENSE TECHNOLOGY CORPORATION
  • Patent number: 11142460
    Abstract: The present disclosure provides a method for repairing defect of graphene, including: firstly introducing a composite fluid containing a reactive compound and a supercritical fluid to a reactor where the graphene powder has been placed, and impregnating the graphene powder with the composite fluid to passivate and repair the defect of graphene, wherein the reactive compound includes carbon, hydrogen, nitrogen, silicon or oxygen element; and separating the composite fluid from the graphene powder, simultaneously using molecular sieves to absorb the graphene from the composite fluid. The present disclosure further provides the graphene powder prepared by the method above. With the method of the present disclosure, it effectively reduces the ratio of the defect of the graphene, increases the content of the graphene, and has less-layer graphene with high thermal conductivity and electrical conductivity.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: October 12, 2021
    Assignee: XSENSE TECHNOLOGY CORPORATION
    Inventors: Zhen-Yu Li, Po-Min Tu, Chia-Jung Chen, Yeu-Wen Huang
  • Patent number: 10660212
    Abstract: The present disclosure provides an element submount and a method for manufacturing the same. The element submount includes a substrate, a first conductive heat-dissipating layer, a second conductive heat-dissipating layer, a first heat-dissipating layer and an element bonding layer. The substrate has opposite first and second surfaces. The first conductive heat-dissipating layer is formed on the first surface. The second conductive heat-dissipating layer is formed on the first surface and separated from the first conductive heat-dissipating layer. The first heat-dissipating layer is formed on the second surface. The element bonding layer is formed on the second conductive heat-dissipating layer. By electroplating and processing techniques, the edge of one or two sides of the element bonding layer exceeds an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: May 19, 2020
    Assignee: XSENSE TECHNOLOGY CORPORATION
    Inventors: Chen-Yu Li, Chia-Jung Chen, Yeu-Wen Huang, Chun-Chung Lin, Chih-Lung Lin