Patents Assigned to XSYS GERMANY GMBH
  • Patent number: 12313970
    Abstract: A photopolymerisable relief precursor includes a dimensionally stable carrier, and a photopolymerisable relief-forming layer at least containing a crosslinkable elastomeric binder, an ethylenically unsaturated monomer, a migration-capable, surface-active additive, a photoinitiator activatable with UVA light and a photoinitiator activatable with UVC light. A method for producing a relief structure.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: May 27, 2025
    Assignee: XSYS GERMANY GMBH
    Inventors: Matthias Beyer, Armin Becker, Torben Wendland, Isabel Schlegel, Peter J Fronczkiewicz, Anja Wundling
  • Patent number: 12210284
    Abstract: A photosensitive composition of a developable relief precursor includes at least one ethylenically unsaturated monomer as component E, at least one photoinitiator or photoinitiator system as component P, at least one water soluble and/or water dispersible binder as component B, and optionally, one or more additives as component A. Component E includes at least one ionic group and component E is present in an amount of 0.1 to 30 wt %, based on the total weight of the photosensitive composition.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: January 28, 2025
    Assignee: XSYS GERMANY GMBH
    Inventors: Thomas Paulöhrl, Christian Pietsch
  • Publication number: 20240061340
    Abstract: A method, a control means and an exposure apparatus for exposing a relief precursor (P) with a light source (2), the illumination area of the light source (2) covering part of the area of the precursor, wherein exposing the total area of the precursor is performed during an exposure pass by moving relatively to each other the light source and the precursor, the method comprising a step (20) of providing a mask (4) on a photosensitive layer, a first exposing step (ES1) comprising exposing during one or more exposure passes the precursor according to a first intensity profile (IP1) and a first speed profile (SP1); a second exposing step (ES2) comprising exposing during one or more exposure passes the precursor according to a second intensity profile (IP2) different from the first intensity profile (IP1) and a second speed profile (SP2) different from the first speed profile (SP1).
    Type: Application
    Filed: December 17, 2021
    Publication date: February 22, 2024
    Applicant: XSYS GERMANY GMBH
    Inventors: Maximilian THATE, Matthias BEYER
  • Publication number: 20240061341
    Abstract: Method for exposing a relief precursor, using a first light source to expose a first side of a relief precursor, a movable second light source to expose a second side of the relief precursor opposite the first side during one or more second exposure periods of one or more second exposure steps, said method comprising the steps of receiving through an operator interface at least one first characteristic representative for the first exposure period and/or at least one second characteristic representative for the one or more second exposure periods determining a sequence of operation for the first light source and the second light source based on the at least one first and/or second characteristic, said sequence being such that each of said one or more second exposure periods either fully overlaps with the first exposure period or does not overlap with the first exposure period.
    Type: Application
    Filed: December 17, 2021
    Publication date: February 22, 2024
    Applicant: XSYS GERMANY GMBH
    Inventors: Maximilian THATE, Johan VERVAECKE, Matthias BEYER
  • Publication number: 20230031598
    Abstract: A photopolymerisable relief precursor includes a dimensionally stable carrier, and a photopolymerisable relief-forming layer at least containing a crosslinkable elastomeric binder, an ethylenically unsaturated monomer, a migration-capable, surface-active additive, a photoinitiator activatable with UVA light and a photoinitiator activatable with UVC light. A method for producing a relief structure.
    Type: Application
    Filed: December 14, 2020
    Publication date: February 2, 2023
    Applicant: XSYS GERMANY GMBH
    Inventors: Matthias BEYER, Armin BECKER, Torben WENDLAND, Isabel SCHLEGEL, Peter J FRONCZKIEWICZ, Anja WUNDLING