Patents Assigned to XTPL S.A.
  • Publication number: 20210285091
    Abstract: A method of decreasing a sheet resistance of a transparent conductor is disclosed. The method includes the following: forming a first transparent conductor layer on a substrate; dispensing a metallic nanoparticle composition on the first transparent conductor layer to form metallic nanoparticle features; and sintering at least the first transparent conductor layer and the metallic nanoparticle features. The first transparent conductor layer includes a crystalline metal oxide. The aperture ratio of the transparent conductor is in a range of 90% to 99%. A multilayer transparent conductor and a method of forming a multilayer transparent conductor are also disclosed.
    Type: Application
    Filed: March 15, 2021
    Publication date: September 16, 2021
    Applicant: XTPL S.A.
    Inventors: Anna Stanczak, Jolanta Gadzalinska, Mateusz Lysien, Aneta Wiatrowska, Filip Granek
  • Patent number: 10731268
    Abstract: A method is provided for forming structures upon a substrate. The method comprises: depositing fluid onto a substrate so as to define a wetted region, the fluid containing electrically polahzable nanoparticles; applying an alternating electric field to the fluid on the region, using a first electrode and a second electrode, so that a plurality of the nanoparticles are assembled to form an elongate structure extending from the first electrode towards the second electrode; and removing the fluid such that the elongate structure remains upon the substrate.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: August 4, 2020
    Assignee: XTPL S.A.
    Inventors: Filip Granek, Zbigniew Rozynek