Abstract: A lapping apparatus includes a processing part and a fixing part. The processing part is provided for a target object to be seated and polishes a lower surface of the target object seated as it rotates. The fixing part is provided for pressing the seated target object against the processing part so that the lower surface of the target object is fixed in a state of being seated on the processing part. The fixing part rotates relative to the processing part along with the target object by shear force applied to the target object from the processing part so that the processing of the lower surface of the target object is made when the processing part rotates while the fixing part fixes the target object, and the location axes of the fixing part and the processing part do not match.

Abstract: A lapping apparatus includes a processing part and a fixing part. The processing part is provided for a target object to be seated and polishes a lower surface of the target object seated as it rotates. The fixing part is provided for pressing the seated target object against the processing part so that the lower surface of the target object is fixed in a state of being seated on the processing part. The fixing part rotates relative to the processing part along with the target object by shear force applied to the target object from the processing part so that the processing of the lower surface of the target object is made when the processing part rotates while the fixing part fixes the target object, and the location axes of the fixing part and the processing part do not match.