Patents Assigned to XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD
  • Method and apparatus for final polishing of silicon wafer
    Patent number: 11488832
    Abstract: Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing includes: within a predetermined period of time remaining before completion of the final polishing, forming a hydrophilic silicon oxide film on a surface of the silicon wafer by using both a polishing slurry and an oxidizing solution as a polishing liquid.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: November 1, 2022
    Assignee: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventor: Jiazhen Zheng
  • METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER
    Publication number: 20210296133
    Abstract: Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing includes: within a predetermined period of time remaining before completion of the final polishing, forming a hydrophilic silicon oxide film on a surface of the silicon wafer by using both a polishing slurry and an oxidizing solution as a polishing liquid.
    Type: Application
    Filed: December 25, 2019
    Publication date: September 23, 2021
    Applicant: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD
    Inventor: Jiazhen Zheng