Patents Assigned to Xynatech, Inc.,
-
Patent number: 6968769Abstract: A die assembly including a first die with a first die surface and a first cutting rib extending from the first die surface. The first cutting rib includes a first cutting surface parallel to the first die surface. The first cutting rib includes a leg extending from the first die surface to the first cutting surface at a first obtuse angle. A second die includes a second die surface and a second cutting rib extending from the second die surface. The second cutting rib includes a second cutting surface parallel to the second die surface. The second cutting surface is generally parallel to and defines a cutting overlap with the first cutting surface at a cross-section taken through the first and second dies in a cutting position. The cutting rib includes a leg extending from the second die surface to the second cutting surface at a second obtuse angle.Type: GrantFiled: September 10, 2002Date of Patent: November 29, 2005Assignee: Xynatech, Inc.Inventor: Pierson S. Kang
-
Publication number: 20040045427Abstract: A die assembly including a first die with a first die surface and a first cutting rib extending from the first die surface. The first cutting rib includes a first cutting surface parallel to the first die surface. The first cutting rib includes a leg extending from the first die surface to the first cutting surface at a first obtuse angle. A second die includes a second die surface and a second cutting rib extending from the second die surface. The second cutting rib includes a second cutting surface parallel to the second die surface. The second cutting surface is generally parallel to and defines a cutting overlap with the first cutting surface at a cross-section taken through the first and second dies in a cutting position. The cutting rib includes a leg extending from the second die surface to the second cutting surface at a second obtuse angle.Type: ApplicationFiled: September 10, 2002Publication date: March 11, 2004Applicant: Xynatech, Inc.Inventor: Pierson S. Kang
-
Patent number: 6223641Abstract: A paper product has a first sheet with a pattern of spaced openings permitting separation into sections and a second sheet releasably attached to the first sheet with a pattern of continuous curvilinear openings dividing the sheet into sections and being aligned with the openings of the first sheet. A die sheet for a die for cutting material includes a die sheet surface with a die pattern extending outwardly from the die sheet surface. The die pattern has slitting sections providing curvilinear, continuous openings through a second sheet of the material and spaced perforating sections extending above the slitting sections providing a pattern of spaced openings in the first sheet adjacent to the openings through the second sheet. A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material.Type: GrantFiled: November 12, 1996Date of Patent: May 1, 2001Assignee: Xynatech, Inc.,Inventor: Pierson S. Kang
-
Patent number: 6136209Abstract: A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material. A chemical removes material from sections not covered by the second pattern and the second pattern is then removed. A chemical removes material from die surface sections not covered by the first pattern. A second method of constructing a die sheet includes covering sections of a die surface with a pattern of photo-resist material having alternating slitting segments and wider perforating segments. A chemical removes material from uncovered sections and completely undercuts the slitting segments to form slitting sections and undercuts the perforating segments to form higher extending perforating sections.Type: GrantFiled: May 23, 1997Date of Patent: October 24, 2000Assignee: Xynatech, Inc.Inventor: Pierson S. Kang
-
Patent number: 5789050Abstract: A paper product has a first sheet with a pattern of spaced openings permitting separation into sections and a second sheet releasably attached to the first sheet with a pattern of continuous curvilinear openings dividing the sheet into sections and being aligned with the openings of the first sheet. A die sheet for a die for cutting material includes a die sheet surface with a die pattern extending outwardly from the die sheet surface. The die pattern has slitting sections providing curvilinear, continuous openings through a second sheet of the material and spaced perforating sections extending above the slitting sections providing a pattern of spaced openings in the first sheet adjacent to the openings through the second sheet. A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material.Type: GrantFiled: May 23, 1997Date of Patent: August 4, 1998Assignee: Xynatech, Inc.Inventor: Pierson S. Kang
-
Patent number: 5488889Abstract: A cutting die for cutting materials is provided. A die sheet having opposing front and back die sheet surfaces is provided. At least one cutting edge defining a die pattern is formed extending outwardly from a portion of the front sheet surface. A spacer abutment extending outwardly from a portion of the back surface of the die sheet is also provided. The spacer abutment is disposed in alignment with the cutting edge. A pressure surface is provided for applying the die sheet to the materials. An abutment surface of the spacer is abutted directly against the carrier surface in order to dispose the cutting edge a predetermined distance from the pressure surface. Cavities formed between adjacent abutments may be filled with an adhesive material in order to secure the cutting die to the pressure surface. The cutting die may be flexible and may be adhesively secured to a cylindrical die carrier.Type: GrantFiled: September 20, 1993Date of Patent: February 6, 1996Assignee: Xynatech, Inc.Inventor: Pierson S. Kang
-
Patent number: 5379671Abstract: A magnetic saddle apparatus for mounting magnetic etched dies onto rotating cylinders and including a segment of a cylinder wall, on an outer surface of which an array of permanent magnets is adhered, a mounting arrangement for fastening the saddle apparatus to a die-cutting cylinder, and a gripping bar, which prevents slippage of small area etched dies during operation of the cutting cylinder.Type: GrantFiled: February 16, 1993Date of Patent: January 10, 1995Assignee: Xynatech, Inc.Inventor: Pierson S. Kang