Patents Assigned to Y.C. LEE
  • Publication number: 20110017431
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Application
    Filed: March 8, 2010
    Publication date: January 27, 2011
    Applicant: Y.C. Lee
    Inventors: Ronggui Yang, Y.C. Lee, Victor M. Bright, Chen Li, G.P. Bud Peterson, Christopher Oshman, Bo Shi, Jen-Hau Cheng
  • Publication number: 20050153377
    Abstract: The present invention provides a method for determining the concentration of C-reactive protein in a sample using labeled phosphorylcholine.
    Type: Application
    Filed: June 14, 2004
    Publication date: July 14, 2005
    Applicants: ORIENTAL YEAST CO., LTD., HIROSHI TAMURA, Y.C. LEE
    Inventors: Hiroshi Tamura, Y.C. Lee, Isamu Takagahara, Yuhsi Matuo, Keiko Saito, Kichitaro Kawaguchi