Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
Type:
Application
Filed:
March 8, 2010
Publication date:
January 27, 2011
Applicant:
Y.C. Lee
Inventors:
Ronggui Yang, Y.C. Lee, Victor M. Bright, Chen Li, G.P. Bud Peterson, Christopher Oshman, Bo Shi, Jen-Hau Cheng