Abstract: The disclosure relates to an electrical contact in which the thickness of the stock material is greater than the width of an insulation displacement slot provided therein. The contact is manufactured utilizing conventional stamping and forming operations to create an insulation displacement slot which could not be previously manufactured using these techniques. The contact has a wire receiving section and a mounting section integrally attached to the wire receiving section. Thinned areas are coined or formed on either side of the insulation displacement slot, thereby causing the width of the insulation displacement slot to be dimensioned to receive and terminate the fine wires therein.
Type:
Grant
Filed:
March 7, 2001
Date of Patent:
August 13, 2002
Assignee:
Y-connect Incorporated
Inventors:
Larry E. Dittmann, Christopher W. Shelly
Abstract: An electrical contact in which the thickness of the stock material is greater than the width of an insulation displacement slot provided therein. The contact is manufactured utilizing conventional stamping and forming operations to create an insulation displacement slot which could not be previously manufactured using these techniques. The contact has a wire receiving section and a mounting section integrally attached to the wire receiving section. An insulation displacement plate is provided on the wire receiving section, the insulation displacement plate has a first portion and a second portion which are positioned proximate each other to form the insulation displacement plate. A first slot portion stamped from the first portion edge and a second slot portion stamped from the second portion edge are positioned to form an insulation displacement slot, whereby the width of the insulation displacement slot can be dimensioned to receive and terminate the fine wires therein.