Abstract: A forming apparatus for bending the leads of a semiconductor package including a body portion, and a plurality of leads extending from the sides of the body portion to a predetermined configuration. The forming die includes a series of walls arranged in a predetermined pattern having a seat for the body portion of the semiconductor package and a series of stepped outer wall portions. A plurality of a elongated spaced rigid portions on the outer surface of the wall portion define a series of grooves for receiving the leads of the semiconductor package. A punch adapted for reciprocating movement relative to the forming die engages and presses the leads into the grooves so that the leads conform to the outer wall portions of the die.

Abstract: In a press for cutting and bending the leads of semiconductor packages, a series of cams on a common drive shaft operate both the feeding mechanism and the working presses to achieve high speed operation, up to 500 cycles per minute, through accurate timing and avoidance of delays inherent in fluid-operated presses. The path of movement of the packages through the apparatus is linear, and the axis of the camshaft is parallel to the path of movement.

Abstract: A forming press for leads of semiconductor packages comprises a package supporting die and a punch. The punch comprises a package securing component movable along a first line of movement, for temporarily securing the package to the die, and a pair of lead bending components, movable, relative to the package securing component, along oblique lines of movement which converge toward the line of movement of the package securing component. The punch assembly includes a holder which supports the package securing component while allowing a limited amount of relative movement. The lead bending components are supported by the package securing component and guided in slots formed in the package securing component. Movement of the lead bending components is effected by rollers on the holder which roll on smooth surfaces at the upper ends of the lead bending components as they push downward thereon, thereby allowing the lead bending components to move in oblique paths as the holder moves in the downward direction.