Patents Assigned to Yagi Anntena Inc.
  • Patent number: 7264409
    Abstract: In a container assembly for a laser diode module in which a temperature control device is not incorporated in advance, a heat-insulative casing is adapted to accommodate the laser diode module. A temperature detector is accommodated in the casing. A thermal coupling member is accommodated in the casing so as to thermally couple the laser diode module and the temperature detector. A heat-conductive plate member is attached to the casing. A heat transfer element is interposed between the thermal coupling member and the plate member so as to allow heat transfer therebetween. A sealing member is disposed between the casing and the plate member so as to seal the heat transfer element. A heat transfer controller causes the heat transfer element to control the heat transfer in accordance with a temperature of the thermal coupling member which is detected by the temperature detector.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: September 4, 2007
    Assignee: Yagi Anntena Inc.
    Inventors: Kazunori Kobayashi, Toshihiro Hosoya
  • Patent number: 7180462
    Abstract: In a UHF broadband antenna, a pair of dipole elements are provided. Each of the dipole elements is shaped into a rectangular plate.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: February 20, 2007
    Assignee: Yagi Anntena Inc.
    Inventors: Atsushi Kaneko, Shuji Hagiwara, Mikihiro Matsuura