Patents Assigned to YAKIMISHU CO. LTD., LLC
  • THREE DIMENSIONAL INTEGRATED CIRCUITS
    Publication number: 20130002296
    Abstract: A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.
    Type: Application
    Filed: September 10, 2012
    Publication date: January 3, 2013
    Applicant: YAKIMISHU CO. LTD., LLC
    Inventor: Raminda Udaya MADURAWE