Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

Abstract: An RFID that performs a wireless communication, including an antenna part (10a) formed by a lead frame (10), a semiconductor device (30) mounted on the lead frame, a first thermoplastic resin (50) configured by performing injection molding on both surfaces of the lead frame so that the semiconductor device is filled, and including a convex portion, and a second thermoplastic resin (56) configured by performing injection molding on both surfaces of the lead frame with reference to a position of the convex portion of the first thermoplastic resin.

Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.

Abstract: A valve body for pumps has a compressed air-filled chamber in the center thereof and a compressed air supply port through which compressed air is supplied into the compressed air-filled chamber. The outer surface of the valve body is provided with an annular groove-shaped air supply chamber that communicates between the compressed air-filled chamber and a pump-side air chamber. Compressed air supplied into the compressed air-filled chamber through the compressed air supply port is supplied into the pump-side air chamber through the air supply chamber.

Abstract: The resin molding machine is capable of cleaning a resin molding die while performing a molding action without stopping the molding action and capable of securely removing contaminations from the resin molding die. The resin molding machine comprises: a press unit including a resin molding die; and a cleaning unit for cleaning a molding face of the resin molding die. The cleaning unit has an energy ray irradiation section, which irradiates an energy ray to the molding face of the resin molding die so as to easily peel off a contamination, which has been stuck on the molding face during a molding action, from the molding face. The contamination is stuck onto resin of a molded product when the product is resin-molded, so that the molded product is released from the resin molding die together with the contamination.

Abstract: A reciprocating fluid transfer pump in which a pilot valve assembly block can be mounted to a main body block in a simple, easy and reliable manner. In the reciprocating fluid transfer pump, a fluid, which has been suctioned into a fluid delivering chamber (19), is discharged therefrom by causing an expanding and contracting action of a barrier membrane (6) which is attached to either end of a center rod (5). The center rod is capable of reciprocating with respect to the main body block (2). A peripheral portion of the barrier membrane (6) is clamped fixedly to the main body block (2) via a main ring (30), and a pilot valve assembly block (17) having an integrated pilot valve (16) for detecting the reciprocating motion of the center rod (5) is pressed against and thus fixedly secured to the main ring (30) via a sub ring (34).

Abstract: The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.

Abstract: The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate having a cavity hole, which defines a shape and thickness of a resin mold section of the work; a mechanism for repeatedly carrying the cavity plate into and out from the press section; and a mechanism for positioning the cavity plate onto the molding die.

Abstract: The resin molding machine is capable of executing many functions and easily expanding and modifying the structure. In the resin molding machine, a loader and an unloader are moved on common rail sections so as to convey a work piece and a molded product. An additional rail unit has a rail section, on which the loader and the unloader can be moved. The additional rail unit is detachably attached between a work piece feeding unit and a product accommodating unit. The common rail sections and the rail section of the additional rail unit are disconnectably connected.

Abstract: A diaphragm-type pumping apparatus (1) includes a pair of diaphragms (12), each defining a fluid delivering chamber (14) and a working fluid chamber (15), a main body section (2) operatively supporting a center rod (11) so as to allow a reciprocating motion thereof, and a pair of casing members (3), arranged so as to hold the main body section 2 from opposite sides thereof and functioning in association with the main body section (2) to clamp the peripheral portions (42), of the respective diaphragms (12), from opposite sides along a thickness direction thereof. The diaphragm has an annular lip section (43) extending in either side along a direction of the reciprocation motion of the center rod (11) and also along the thickness direction of the diaphragm 12.

Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.

Abstract: A restarting device of a pump including a center rod defining fluid delivering chambers and driving chambers 11b and 12b. The restarting device of the pump further includes: a change-over valve 2 for switching a direction for the center rod to move, and a restarting hydraulic circuit 3 which, when a supply of the driving fluid from the change-over valve 2 to the driving chambers 11b and 12b in both sides is stopped, detects the supply of the driving fluid into the driving chambers 11b and 12b in both sides having been stopped and then causes the driving fluid to flow into the change-over valve, thereby restarting the supply of the driving fluid into the driving chambers 11b and 12b.

Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: A pressure pump delivers a high viscosity fluid (32B) such as grease from a storage can or drum (32A) sealed by a follower plate unit (5) attached to a hollow transfer tube (4). The unit (5) can be air operated to reciprocate up and down relative to the storage can. The unit (5) has a body (6) fitting into the can with fluid guide passage (7) fitted inside a reciprocating cylinder (11) attached by a ring plate (12). An upper plate (17) is attached to the cylinder (11) and a lower plate (16) is attached to body (6) with a ring sealing member (18) interposed between the plates (16,17). An annular pressure chamber (27) between body (6) and cylinder (11) has a compressed air inlet/outlet port (28) to provide the required reciprocating movement. The seal member (18) can act as a bellows to maintain a seal as the cylinder reciprocates vertically.