Abstract: Provided is a polishing composition capable of speeding up a mirror polishing in terms of polishing rate and the like, improving the smoothness and the flatness of a wafer surface of a semiconductor wafer after the mirror polishing, enabling mirror finishing with high processing accuracy, and having excellent storage stability. The polishing composition is for polishing a polishing target including a group III-V compound as a constituent component, and includes colloidal silica, an oxidizing agent, an oxidation accelerator for accelerating the oxidation reaction on the surface of the polishing target by the oxidizing agent, a stabilizer for controlling the accelerating action of the oxidation reaction on the surface of the polishing target by the oxidation accelerator, and water.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, the polishing composition containing colloidal silica, at least one of a phosphorus-containing inorganic acid and a phosphorous-containing organic acid, and water. According to at least one embodiment, the colloidal silica in the polishing composition has an average particle diameter (D50) in the range of 5 to 50 nm observed by a transmission electron microscope. In measuring a volume-based particle size distribution of the colloidal silica by dynamic light scattering, when the particle size distribution is measured by adjusting a concentration of colloidal silica particles to be 0.25 mass %, the colloidal silica contains 10 vol % or less of colloidal silica particles larger than 50 nm. The polishing composition has 1 to 50 mass % of the colloidal silica, and the pH (25° C.) in the range of 0.1 to 4.0. The colloidal silica is stabilized by sodium or ammonium.

Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized wet-process silica particles having an average particle size of 100 to 1000 nm, and water. According to an embodiment, a ratio of the colloidal silica is 5 to 90% by mass, a ratio of the fumed silica is 5 to 90% by mass, and a ratio of the pulverized wet-process silica particles is 5 to 90% by mass with respect to all the silica particles, and a concentration of all the silica particles is 1 to 50% by mass.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate containing colloidal silica, a water-soluble polymer, and water. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers. The water-soluble polymer compound has a weight average molecular weight of 1,000 to 1,000,000.

Abstract: Embodiments relate to a polishing composition is an aqueous composition containing at least colloidal silica, wet-process silica particles, and a water-soluble polymer compound. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate containing colloidal silica, a water-soluble polymer, and water. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers. The water-soluble polymer compound has a weight average molecular weight of 1,000 to 1,000,000.

Abstract: Embodiments relate to a polishing composition is an aqueous composition containing at least colloidal silica, wet-process silica particles, and a water-soluble polymer compound. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments provide a polishing composition for a magnetic disc substrate including colloidal silica, a phosphorus-containing compound, a water-soluble polymer compound, and water. According to at least one embodiment, the water-soluble polymer compound is a copolymer having a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments relate to a polishing composition for a magnetic disk substrate, where the polishing composition contains colloidal silica, a water-soluble polymer compound, and water. According to at least one embodiment, the water-soluble polymer compound has a weight average molecular weight of 20,000 to 10,000,000 and a concentration of 0.0001 to 2.0% by mass.

Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.

Abstract: Embodiments of the subject application provide a polishing composition for a magnetic disk substrate, whereby the polishing composition contains colloidal silica, at least one of a phosphorus-containing inorganic acid and an organic acid, and water. According to at least one embodiment, the colloidal silica in the polishing composition has an average particle diameter (D50) in the range of 5 to 50 nm observed by a transmission electron microscope. In measuring a volume-based particle size distribution of the colloidal silica by dynamic light scattering, when the particle size distribution is measured by adjusting a concentration of colloidal silica particles to be 0.25 mass %, the colloidal silica contains 10 vol % or less of colloidal silica particles larger than 50 nm. According to at least one embodiment, the polishing composition has 1 to 50 mass % of the colloidal silica, and the polishing composition has the pH (25° C.) in the range of 0.1 to 4.0.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized wet-process silica particles having an average particle size of 100 to 1000 nm, and water. According to an embodiment, a ratio of the colloidal silica is 5 to 90% by mass, a ratio of the fumed silica is 5 to 90% by mass, and a ratio of the pulverized wet-process silica particles is 5 to 90% by mass with respect to all the silica particles, and a concentration of all the silica particles is 1 to 50% by mass.

Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments relate to a polishing composition for a magnetic disk substrate, where the polishing composition contains colloidal silica, a water-soluble polymer compound, and water. According to at least one embodiment, the water-soluble polymer compound has a weight average molecular weight of 20,000 to 10,000,000 and a concentration of 0.0001 to 2.0% by mass.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.

Abstract: Embodiments provide a polishing composition for a magnetic disc substrate including colloidal silica, a phosphorus-containing compound, a water-soluble polymer compound, and water. According to at least one embodiment, the water-soluble polymer compound is a copolymer having a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.