Abstract: A surface treatment apparatus applies a hydrophilic treatment to a bonding surface of a target object bonded to a bonded object using hydrogen bonding, the hydrophilic treatment being applied prior to the bonding. The surface treatment apparatus includes a support base and a spray nozzle. The support base supports a surface of the target object opposite to the bonding surface, the target object being one or more target objects. The spray nozzle causes dew condensation temporarily on the bonding surface by spraying, onto the bonding surface of the target object supported by the support base, humidified air having a water vapor pressure equal to or higher than a saturated water vapor pressure corresponding to a temperature of the bonding surface.

Abstract: An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.

Abstract: Provided is a transfer apparatus. The transfer apparatus includes, in addition to a non-contact chuck that lifts and holds a workpiece in a non-contact manner, a plurality of ultrasonic vibrators that radiate ultrasonic waves. The plurality of ultrasonic vibrators are configured to radiate the ultrasonic waves to generate a standing wave that attracts the workpiece and are configured for the non-contact chuck to hold the workpiece at a position where forces attracting in a plurality of directions toward outside of the workpiece are balanced when viewed from a direction facing the workpiece.

Abstract: Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a first bonding surface between the pad and the wire; and a bonding determination unit which determines the bonding state between the pad and the wire based on the transmission waveform and the reflection waveform detected by the waveform detector.