Patents Assigned to Yamaichi Co., Ltd.
  • Publication number: 20120187971
    Abstract: The invention provides a high-frequency vertical spring probe card structure including a plurality of probes. Each of the probes includes at least one conducting layer and at least one insulating layer. The conducting layer includes a first contact end and a second contact end used for electrically contacting an external component while the probe is compressed and includes a probe body including at least one plate portion and at least one resilient portion connected to each other. The plate portion is used for supporting deformation of the resilient portion while the resilient portion is compressed vertically. The insulating layer includes at least one plate member tightly attached to the plate portion of the conducting layer correspondingly. The probe structure of the invention is simple and can be formed as multi-layer stack structure by electroplating through Lithographie GaVanoformung Abformung (LIGA) technology.
    Type: Application
    Filed: January 5, 2012
    Publication date: July 26, 2012
    Applicant: PLeader-YAMAICHI Co., Ltd
    Inventor: Cheng-Lung Huang
  • Patent number: 5608936
    Abstract: A pillow has a bag which is made of mesh or the like and fully filled with filling materials, each of which is made of a flexible resin, has a hollow configuration such as a hollow sphere or a hollow body and made of a flexible resin and has two or more openings on its surface.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: March 11, 1997
    Assignee: Yamaichi Co., Ltd.
    Inventor: Kiyoshi Nomura