Abstract: An electronic component testing laminated board suitable for performing a heat test on electronic components of a multikind and small quantity production type. The laminated board includes a metal plate, a testing circuit layer including a double-sided printing wiring board or the like and integrally formed through a thin electric insulating layer on one side of the metal plate for mounting thereon electronic components to be tested, and a heater circuit layer including a metal foil circuit or the like and integrally formed through another electric insulating layer on the other side of the metal plate for maintaining the testing circuit layer at a given temperature. An inorganic filler or the like is added to the electric insulating layers. An electronic component testing box for removably accommodating the electronic component testing lamianted board includes walls made of a heat insulating material, power supply connecting connector, signal input and output connector, temperature measuring apparatus, etc.

Abstract: A matrix pin board has a plurality of transversely and longitudinally extending I-shaped elements with the flanges having a plurality of semicircular recesses spaced at intervals along the edges thereof. The I-shaped elements are side by side to form two insulating plates with channels therethrough and the flanges abutting to define holes at the recesses therein. The bottom flanges of the uppermost elements have a plurality of T-shaped transverse recesses therein at spaced intervals therealong, and the top flanges on the lowermost I-shaped elements extend through the T-shaped recesses. The holes defined by the flanges of the elements are aligned in vertical lines extending through the channels.