Patents Assigned to Yamato Electronic Co., Ltd.
  • Patent number: 8766524
    Abstract: A lead-free glass material for sealing organic EL elements is provided with which satisfactory sealing quality is obtained through laser sealing without requiring the addition of a metallic powder. The lead-free glass material for sealing organic EL elements has a glass composition which comprises, in terms of mol %, 30-60% V2O5, 5-20% ZnO, 5-20% BaO, 15-40% TeO2, 0-7% Nb2O5, 0-7% Al2O3, 0-5% SiO2, 0-5% MgO, 0-5% Sb2O3, 0-4% CuO, and 0-4% SnO and in which Nb2O5+Al2O3 is 0.5-10%, SiO2+MgO+Sb2O3 is 0-5%, and CuO+SnO is 0-4%. The glass material has low-temperature softening properties, melt stability, and a low coefficient of thermal expansion and is inhibited from thermally adversely affecting organic EL elements The glass material can attain high sealing properties and high sealing strength in high yield.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: July 1, 2014
    Assignees: Yamato Electronic Co., Ltd., Ambro Co., Ltd.
    Inventors: Yoshihiro Kohara, Akihiro Ota, Seungwoo Lee
  • Patent number: 7585798
    Abstract: A lead-free glass material for use in sealing, which has a glass composition being free of lead and exhibits high performance in the range of choices for the material to be sealed, the sealing processability, the sealing quality and the like, has a glass composition including four types of metal oxides of V2O5, ZnO, BaO and P2O5 as essential ingredients.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: September 8, 2009
    Assignee: Yamato Electronic Co., Ltd.
    Inventors: Masahiro Yoshida, Yasuo Hatate, Tsugumitsu Sarata, Yoshimitsu Uemura, Tomoyuki Honda
  • Patent number: 7425518
    Abstract: Provided with a glass composition including a network-former oxide composed of any one of or both of B2O3 and V2O5 of 20-80% by weight, ZnO of 0-60% by weight and BaO of 0-80% by weight, wherein at least one of ZnO and BaO is included as an essential ingredient. The present invention is a glass material for use in sealing, which is of lead-free series, can be used for sealing at a low processing temperature and within a wide temperature range, has a low thermal expansion coefficient, superior adhesion, superior sealing processability, superior adherence, superior chemical stability, superior strength and the like and comprises sufficient practical performance to substitute for lead glass.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: September 16, 2008
    Assignee: Yamato Electronic Co., Ltd.
    Inventors: Masahiro Yoshida, Yasuo Hatate, Tsugumitsu Sarata, Yoshimitsu Uemura, Tomoyuki Honda, Hiroyuki Fukunaga, Masahiro Iwashita