Abstract: A digital non-contact blade position detection apparatus is provided for use on a wafer dicing machine for blade position detection so as to correct the position of the cutting blade.
Type:
Grant
Filed:
October 30, 1998
Date of Patent:
February 19, 2002
Assignees:
Industrial Technology Research Institute, Yang Iron Works Co., Ltd.
Inventors:
Chien-Rong Huang, Chih-Yi Lai, Chien-Hsing Lin, Chun-Hung Liu