Abstract: A drum cathode for the electrolytic production of metal foil having a current collection yoke of high current carrying capacity which electrically connects each end of the drum to a current collecting hub in the center of the drum. The current collecting hub is positioned on an electrically conducting sleeve over the drum's shaft for conducting the collected current to the exterior of the drum. This permits the electric current to flow through the top sheet of the drum symmetrically to enable the production of foil having a more uniform and symmetrical weight distribution across the width of the drums.

Abstract: A continuous process for electrocoating a thin, uniform protective resinous coating, e.g., an epoxy or acrylic resin, on a matte surface of printed circuit grade copper foil, the matte surface having been treated to increase its surface area, and for curing the coating to obtain improved, high quality copper foil for use in printed circuit boards.

Abstract: A composite foil having an electrolytically formed copper or copper-containing layer and a second electrolytically formed copper layer of a thickness which is not self-supporting, the copper layer and the second metal layer being separated by a coating of a release agent. A process for producing such a composite foil wherein the thin copper layer is formed in a single plating bath containing a copper acid electrolyte. A method for producing copper clad elements suitable for the manufacture of printed circuits from such foils and laminates so produced.

Abstract: Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.