Patents Assigned to YBL Co. Ltd.
  • Patent number: 7337978
    Abstract: The present invention relates to a Dual Interface IC card including a top layer, a bottom layer, an antenna embedding layer between the top and bottom layers and an IC chip module embedded in an IC chip module embedding hole. The antenna embedding layer has a groove in a rectangular shape at its one side where elastic plates are embedded in both sides of the groove. The IC chip module is inserted by applying an adhesive onto the antenna embedding layer or using an adhesive tape. Thus, the IC chip module is easily installed and not detached to give a good connection and a long time use.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: March 4, 2008
    Assignee: YBL Co. Ltd.
    Inventor: Kyeong Ku Lee
  • Publication number: 20060054709
    Abstract: The present invention relates to a Dual Interface IC card including a top layer, a bottom layer, an antenna embedding layer between the top and bottom layers and an IC chip module embedded in an IC chip module embedding hole. The antenna embedding layer has a groove in a rectangular shape at its one side where elastic plates are embedded in both sides of the groove. The IC chip module is inserted by applying an adhesive onto the antenna embedding layer or using an adhesive tape. Thus, the IC chip module is easily installed and not detached to give a good connection and a long time use.
    Type: Application
    Filed: August 18, 2005
    Publication date: March 16, 2006
    Applicant: YBL Co. Ltd.
    Inventor: Kyeong Lee