Abstract: A heat conduction device and a manufacturing method thereof are provided. The heat conduction device includes a first plate, a second plate and a capillary structure. The first plate is connected opposite to the second plate. The capillary structure is formed on space between the first plate and the second plate. A vapor channel is formed on a region of the space outside the capillary structure.

Abstract: A heat conduction device and a manufacturing method thereof are provided. The heat conduction device includes a first plate, a second plate and a capillary structure. The first plate is connected opposite to the second plate. The capillary structure is formed on space between the first plate and the second plate. A vapor channel is formed on a region of the space outside the capillary structure.

Abstract: A light emitting diode (LED) lamp including a connector, an LED module, an angle adjusting ring, an isolating ring, and a heat dissipating module is provided. The LED module is electrically connected to the connector and has at least one LED unit. The angle adjusting ring is disposed between the LED module and the connector for rotating the LED module, and includes at least one locking element for fixing the LED module on the connector. The isolating ring is disposed between the connector and the angle adjusting ring. The heat dissipating module is in contact with the LED module for preventing the LED module from overheating. The heat dissipating module includes at least one heat pipe and a plurality of fins connecting to the at least one heat pipe, where the at least one LED unit is disposed on the at least one heat pipe.

Abstract: An LED lamp has a base, a tubular conductor, a bulb and at least one LED. The base is metallic and has an electrical connector. The tubular conductor is filled with a fluid and mounted on the base and has a distal end and a proximal end. The bulb is pellucid and connected to the base. The at least one LED is mounted on the distal end of the tubular conductor and electrically connected to the connector of the base. The fluid in the tubular conductor may vaporize close to operating temperatures of the LED so transports heat away from the LED quickly and efficiently so allowing high power or multiple LEDs to be implemented, so improving brightness of the LED lamp and commercial applications.

Abstract: A sintered heat pipe, a manufacturing method thereof and a manufacturing method for a groove tube thereof are provided. The sintered heat pipe includes a groove tube, a sintered powder layer and a working fluid. The groove tube has a plurality of grooves and a first end and a second end opposite to the first end. Each groove extends along an axial direction of the groove tube. The first end and the second end are closed. The sintered powder layer is formed on an inside wall of the groove tube, and the groove tube is filled with the working fluid. The size of each powder in the sintered powder layer is greater than a width of each of the grooves.

Abstract: An ultra-thin heat pipe and a manufacturing method thereof are provided. The ultra-thin heat pipe includes a flat pipe body and a powder-sintered portion. The flat pipe body has an internal wall, a first groove set and a second groove set, wherein the first groove set and the second groove set are disposed on the internal wall and spaced apart from each other, and each groove of the first groove set and the second groove set is extended along an extension direction of the flat pipe body. The powder-sintered portion is disposed within the flat pipe body and connects both the first groove set and the second groove set for forming at least one vapor channel with the internal wall.

Abstract: A light emitting diode (LED) lamp including a connector, an LED module, an angle adjusting ring, an isolating ring, and a heat dissipating module is provided. The LED module is electrically connected to the connector and has at least one LED unit. The angle adjusting ring is disposed between the LED module and the connector for rotating the LED module, and includes at least one locking element for fixing the LED module on the connector. The isolating ring is disposed between the connector and the angle adjusting ring. The heat dissipating module is in contact with the LED module for preventing the LED module from overheating. The heat dissipating module includes at least one heat pipe and a plurality of fins connecting to the at least one heat pipe, where the at least one LED unit is disposed on the at least one heat pipe.

Abstract: A heat pipe comprises a metal tube and a sintered powder layer formed on an inner wall face of the metal tube. The sintered powder layer has a plurality of fine passages extending axially. The sintered powder layer may cover the inner wall face of the metal tube entirely or partially.

Abstract: A sintered heat pipe comprises: a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. With this structure, the liquid medium in the capillary grooves which moves toward a hot segment can be prevented from being blown by vapor moving toward the cold segment while the liquid medium condensed from the vapor at the cold segment can enter the capillary grooves without difficulty.

Abstract: An ultra-thin heat pipe comprises a flat metal tube and one or more sintered powder portions. The flat metal tube has an upper tube wall, a lower tube wall and two lateral walls connecting with the upper tube wall and the lower tube wall. The sintered powder portions extends axially and are formed on an inner face of at least one of the upper tube wall, the lower tube wall and the lateral walls such that vapor passage space is formed at one or more sides of the sintered powder portions.

Abstract: A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.

Abstract: An LED lamp has a base, a tubular conductor, a bulb and at least one LED. The base is metallic and has an electrical connector. The tubular conductor is filled with a fluid and mounted on the base and has a distal end and a proximal end. The bulb is pellucid and connected to the base. The at least one LED is mounted on the distal end of the tubular conductor and electrically connected to the connector of the base. The fluid in the tubular conductor may vaporize close to operating temperatures of the LED so transports heat away from the LED quickly and efficiently so allowing high power or multiple LEDs to be implemented, so improving brightness of the LED lamp and commercial applications.

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract: This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core, and multiple tunnels are formed on the wick network core, and one end of the tunnels converges at a vapor chamber and is connected to a loop pipe to form a gaseous working medium outlet, and the terminal end of the pipe extends into and comes into contact with the internal part of the wick network core, and a compensation chamber for liquid working medium is formed on the upper section of the wick network core. Consequently, the cyclic loop that separates the gas and liquid enables the optimal heat dissipation capacity, and also has a structure that is simplified, thereby allowing for easy mass production.

Abstract: A method of making a length of heat conduction pipe from a long conduction pipe filled with heat transfer medium in vacuum environment comprises: a material preparation step in which a long heat conduction pipe with predetermined length sealed at both ends is prepared, a squelching and cutting step in which squelching and cutting is conducted on pre-determined point of said long heat conduction pipe in vacuum environment; a sealing step by which the cut end of said long heat conduction pipe is brazed and sealed in vacuum. There also provides an equipment for performing the method.

Abstract: This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core, and multiple tunnels are formed on the wick network core, and one end of the tunnels converges at a vapor chamber and is connected to a loop pipe to form a gaseous working medium outlet, and the terminal end of the pipe extends into and comes into contact with the internal part of the wick network core, and a compensation chamber for liquid working medium is formed on the upper section of the wick network core. Consequently, the cyclic loop that separates the gas and liquid enables the optimal heat dissipation capacity, and also has a structure that is simplified, thereby allowing for easy mass production.

Abstract: An end sealing structure for heat pipe includes a sealed conical end formed at an end of the heat pipe, which is formed from a hollow metal pipe having a dead end opposite to the sealed conical end. The conical end is sealed at an outmost end thereof by more than one layer of weld bond, and coated with more than one layer of tin solder to enclose the weld bonds and the conical end, enabling the sealed conical end to keep an absolutely sealed state even the heat pipe is compressed in fabricating or under high internal pressure in a heated state. The heat pipe with the sealed conical end can therefore provide good heat-transport capability in a computer or any other apparatus that generates heat during operation thereof.