Patents Assigned to Yen Technologies, LLC
  • Patent number: 10141124
    Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: November 27, 2018
    Assignee: Yen Technologies, LLC
    Inventor: William S. H. Cheung
  • Patent number: 9508490
    Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: November 29, 2016
    Assignee: YEN TECHNOLOGIES, LLC
    Inventor: William S. H. Cheung
  • Publication number: 20140233151
    Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
    Type: Application
    Filed: April 25, 2014
    Publication date: August 21, 2014
    Applicant: YEN TECHNOLOGIES, LLC
    Inventor: WILLIAM S.H. CHEUNG
  • Patent number: 8732925
    Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: May 27, 2014
    Assignee: Yen Technologies, LLC
    Inventor: William S. H. Cheung
  • Patent number: 8156622
    Abstract: A method of fabricating an electronic component is provided. The method includes placing a plurality of electrodes in a stack. Spacing between adjacent electrodes in the stack is determined by one or more removable spacers. The method further includes bonding adjacent electrodes together to fix the spacing and removing the spacers from between the adjacent electrodes.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: April 17, 2012
    Assignee: Yen Technologies, LLC
    Inventor: William S. H. Cheung