Abstract: Disclosed is a humidity control system for an EFEM using desiccant includes the equipment front end module (EFEM) including a transfer chamber being a space, in which a processing target object is transferred into a processing module, and a desiccant equipment installed in the EFEM to be separable, and that controls a humidity of the transfer chamber, the desiccant equipment includes a plurality of block bodies coupled to or separated from each other, and being transportable individually, each of the plurality of block bodies accommodates a humidity control equipment, and the humidity control equipment includes: a desiccant rotor including an adsorbent that adsorbs moisture of air that is to be supplied to the transfer chamber, and being rotated by a driving motor, and a regenerative heater that heats the air and causes the heated air to remove the moisture adsorbed to the adsorbent.

Abstract: A dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.

Abstract: Disclosed is a high-pressure annealing device including a nozzle assembly. The high-pressure annealing device is configured to prevent, when gas is supplied to the inside of a chamber of the high-pressure annealing device through a gas nozzle, damage generated during coupling of the gas nozzle to a gas supply module.

Abstract: Disclosed is a high-pressure annealing device including an internal chamber configured to provide an internal space, an external chamber configured to accommodate the internal chamber therein, a heating module configured to perform heat treatment and disposed in an external space provided between the internal chamber and the external chamber, and a shielding element configured to seal the lower portion of the external space, thereby preventing dispersion of particles generated from the heating module and preventing contamination of a substrate (a semiconductor wafer) due to the particles.

Abstract: Disclosed are a jig device for attachment and detachment of a heater unit, a system for attachment and detachment of the heater unit, and a high-pressure annealing device capable of attaching and detaching the heater unit thereto and therefrom. The heater unit is attachable to or detachable from the high-pressure annealing device through upward movement or downward movement of the heater unit from or toward the lower portion of an outer chamber in a state in which the heater unit disposed in the high-pressure annealing device is supported by the jig device.

Abstract: Disclosed is a humidity control system for an EFEM using desiccant includes the equipment front end module (EFEM) including a transfer chamber being a space, in which a processing target object is transferred into a processing module, and a desiccant equipment installed in the EFEM to be separable, and that controls a humidity of the transfer chamber, the desiccant equipment includes a plurality of block bodies coupled to or separated from each other, and being transportable individually, each of the plurality of block bodies accommodates a humidity control equipment, and the humidity control equipment includes: a desiccant rotor including an adsorbent that adsorbs moisture of air that is to be supplied to the transfer chamber, and being rotated by a driving motor, and a regenerative heater that heats the air and causes the heated air to remove the moisture adsorbed to the adsorbent.

Abstract: A dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.