Patents Assigned to Ying Mfg., Corp.
  • Patent number: 4154222
    Abstract: Heat transfer structure comprises:A. sandwich assembly including a heat transfer plate to receive infra-red radiation or to transmit such radiation, respectively to or from skyward,B. the assembly defining an enclosed gas flow chamber at the underside of said plate, there being spaced air inlet and outlet ports respectively to and from the chamber, andC. baffling in said chamber to direct gas passing through the chamber via said ports to freely flow tortuously and with turbulence adjacent major extent of the underside of said plate.
    Type: Grant
    Filed: September 15, 1977
    Date of Patent: May 15, 1979
    Assignee: Ying Mfg., Corp.
    Inventor: Ying-Nien Yu