Abstract: Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

Abstract: Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.

Abstract: One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

Abstract: One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

Abstract: Disclosed is an electroplating method for printed circuit board. The method includes: providing a printed circuit board including a circuit pattern, a pad part on which components are mounted, a terminal part for electrical connection to an external device, and a connector part; masking the portion of the printed circuit board other than the terminal part and the connector part; dipping the printed circuit board in a nickel-tungsten alloy plating solution including a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent, and a ductility improver; forming a nickel-tungsten alloy plated layer on each of the exposed portions of the terminal part and the connector part by direct-current (DC) electroplating; and forming a gold-containing plated layer on the nickel-tungsten alloy plated layer by DC electroplating.

Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.

Abstract: The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

Abstract: Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or copper alloy layer, is plated with palladium (Pd) or a palladium alloy, and then gold (Au) or a gold alloy is deposited over the palladium or palladium alloy plated layer by an electroless substitution plating process based on ionization tendency. Having superior hardness, ductility and corrosion resistance, palladium is suitable for use between a connector and a substrate and meets requirements for the printed circuit board even when applied to a low thickness, greatly reducing the process time. Accordingly, the problem of black pad, which frequently occur on electroless nickel and electroless gold finish upon surface mount technology, can be perfectly solved. Particularly, fatal bending cracks can be prevented from occurring in the rigid-flexible or flexible printed circuit boards.