Patents Assigned to Yoshino Denka Kogyo, Inc.
  • EMI shield and a method of forming the same
    Patent number: 5945213
    Abstract: Improved shield against electromagnetic interference comprises an undercoat formed on at least one surface of a nonconductive substrate comprising a jacket or case of electronic equipment or part thereof that are vulnerable to electromagnetic interference and a metal layer formed over said undercoat; said undercoat is composed of 10-60 wt % of a composite metal oxide hydrate and 40-90 wt % of a binder and said metal layer is formed by electroless plating of copper and/or nickel.
    Type: Grant
    Filed: August 27, 1996
    Date of Patent: August 31, 1999
    Assignee: Yoshino Denka Kogyo, Inc.
    Inventors: Ippei Nagaike, Ryozo Mizuguchi, Masatomo Yanase