Abstract: A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.

Abstract: A control circuit for balancing current in a thin display device includes a light source, a power supply, and a control part. The light source includes a plurality of parallel light-emitting diode (LED) rows. The LED row includes at least one LED and a switch unit. The switch unit is in series connection with the LED. The switch unit has two working conditions, one is on and the other is off, to determine whether the current passes through the LED row. The power supply provides a working power for the LEDs. The control part detects the currents of the LED rows, controls the on-state timing ratio of the switch unit and controls the output power of the power supply.

Abstract: A light-emitting diode light source system includes a plurality of light-emitting diode modules for providing light beams; a light-combining unit including a plurality of light incident sides and a light emerging side, the light beams from the light-emitting diode modules entering the light-combining unit via the light incident sides, respectively, and emerging out of the light-combining unit via the light emerging side; a plurality of primary lens units disposed between the light-emitting diode modules and the light incident sides, respectively; a secondary lens unit disposed to confront the light emerging side; and a focusing lens disposed adjacent to the secondary lens unit, the secondary lens unit being disposed between the light-combining unit and the focusing lens, the light beams from the light-emitting diode modules passing through the primary lens units, the light-combining unit, the secondary lens unit and the focusing lens to be projected onto a light valve.

Abstract: A light emitting diode (LED) package including a carrier, an LED chip, a first transparent encapsulant, a transparent cap, and a second transparent encapsulant is provided. The carrier has a carrying surface and a ring frame disposed on the carrying surface, and the ring frame forms an encapsulant-containing space on the carrying surface. The LED chip is disposed on the carrying surface and in the encapsulant-containing space. The LED chip is electrically connected to the carrier. The first transparent encapsulant fills the encapsulant-containing space to encapsulate the LED chip. The transparent cap is disposed on the carrier to cover the first transparent encapsulant and the ring frame. The second transparent encapsulant fills an interval between the first transparent encapsulant and the transparent cap.

Abstract: A backlight module includes a panel, a base, at least a light-emitting element, a heat-dissipating board and at least a circuit board. The base is connected to the panel to form an accommodating space. The light-emitting element is disposed in the accommodating space. The heat-dissipating board is disposed on the base and connected to the base. The heat-dissipating board includes at least two connecting portions and a top portion. The connecting portions are respectively connected to two ends of the top portion and the base to separate the top portion from the base for forming a heat-dissipating space therebetween. The circuit board is disposed on an outer surface of the top portion far away from the base.

Abstract: A light-emitting device includes a package housing, at least one light-emitting element, a plurality miniature elements, and a package filler. The package housing includes a recess. The light-emitting element is disposed in the recess. The miniature elements are formed on the light-emitting element. Light from the light-emitting element is output to the exterior of the recess in a predetermined direction by adjustment of the miniature elements. The package filler is filled in the recess and covers the light-emitting element and miniature elements.

Abstract: A liquid crystal display module and an integrated driving board thereof are disclosed. The driving board includes a substrate, a circuit pattern, a timing clock driver, a light emitting diode (LED) driving module, a color management module and a photosensitive chip. The circuit pattern is disposed on the surface of the substrate. The timing clock driver, the LED driving module, the color management module and the photosensitive chip are disposed on the substrate and electrically coupled to the circuit pattern. The LED driving module is electrically coupled to the timing clock driver. The color management module is electrically coupled to the LED driving module. The photosensitive chip is electrically coupled to the color management module.

Abstract: A backlight module includes a light box, at least one light guide tube, and at least one light source. The light box has a light exit side. The light guide tube has a plurality of microstructures which are spaced apart along a length of the light guide tube. The light guide tube and the microstructures are disposed in the light box in a particular arrangement so that the microstructures are placed substantially in a matrix array within the light box. The light source is disposed adjacent to the light guide tube, and is operable so as to emit a light beam to the light guide tube. The microstructures disperse the light beam from the light guide tube.

Abstract: A light source driving circuit for a backlight module is disclosed, wherein each driving unit includes a reference resistor, a transistor, a bias resistor and a shunt regulator. The transistor is coupled between an LED string and the reference resistor, and the bias resistor is coupled between an operation voltage and the control terminal of the transistor. The shunt regulator is coupled between the control terminal of the transistor and a common terminal, and the reference pin of the shunt regulator is coupled to the common node between the reference resistor and the transistor.

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract: A switching system capable of reducing the noise of the output signal is provided. The switching system includes a first switch and a second switch, wherein the first switch conducts a first signal according to a first control signal; the second switch conducts a second signal according to a second control signal. And the voltages of the first control signal and the second control signal are restricted within a voltage interval to reduce the noise produced during the switching of the switches.

Abstract: A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.

Abstract: A lens defines central axis, and includes a light receiving surface, a light reflecting surface, and a light exiting surface. The light reflecting surface is opposite to the light receiving surface along the central axis. The light exiting surface extends between the light receiving surface and the light reflecting surface. When a light source emits a light, a portion of the light emitted by the light source passes through the light receiving surface, and is incident on and is reflected at a plurality of reflections angles by the light reflecting surface to the light exiting surface so as to exit the lens in directions perpendicular to the light exiting surface for all said plurality of reflection angles.

Abstract: A backlight module comprises a baseboard, at least one light-emitting element and a heat-dispersing member. The baseboard has at least one through-hole. The light-emitting element is installed in one of the through-holes and is electrically connected to a surface of the baseboard. The heat-dispersing member adjacent to the baseboard can contact the light-emitting elements directly.

Abstract: A light emitting diode (LED) package including a carrier, an adhering layer and an LED chip is provided. The adhering layer is disposed on the carrier. The LED chip is disposed on the adhering layer and electrically connected to the carrier. The material of the adhering layer comprises a lead-free tin-based eutectic alloy. Furthermore, a manufacturing method for the LED package is provided.