Abstract: A method for packaging an image sensor includes the steps of providing a substrate, forming a first adhesive on one surface of the substrate, attaching a transparent material on the first adhesive, cutting or carving the surface of the transparent material to a depth penetrating the transparent material while not penetrating the first adhesive, cleaning the cut or carved surface of the transparent material, depositing a frame glue on the transparent material, and combining the transparent material with a microchip that includes a plurality of micro-lenses. The micro-lens is packaged within the transparent material. The microchip is then ground to perform a lithography process. Next, the substrate and part of the first adhesive are detached after the lithography process. After performing a cutting or carving procedure, the packaging process of the image sensors is completed.

Abstract: Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.