Abstract: The invention relates to a composition comprising: a) 30-90 wt % of a polyamide and b) 10-40 wt % of a polyethylene elastomer (POE) composition, wherein the amounts of a) and b) are with respect to the total composition, wherein the total of a) and b) is at least 60 wt % with respect to the total composition, wherein the POE composition consists of: b1) 20-95 wt % of a non-functionalized polyethylene elastomer and b2) 5-80 wt % of a functionalized polyethylene elastomer, wherein the amounts of b1) and b2) are with respect to the POE composition.

Abstract: An electronic device module including a glass cover sheet, a polymeric front polymeric material, an electronic device, a polymeric back material and a backsheet, wherein the polymeric front and/or back materials have a trilayer structure including a back layer which is adhered to a surface of the electronic device, a front layer which is adhered to the glass cover sheet or the backsheet and an intermediate layer between the back layer and the front layer, wherein each of the back layer and the front layer includes an ethylene interpolymer grafted with silane, wherein the ethylene interpolymer grafted with silane has a density of at most 0.905 g/cm3, and the intermediate layer is a non-grafted ethylene interpolymer having a density of at most 0.905 g/cm3, which is crosslinked with the aid of a crosslinking initiator and optionally a crosslinking coagent, and optionally additives.