Abstract: A microchip includes a PCB, a first contact feature positioned along a first area of the PCB, a second contact feature positioned along a second area of the PCB that is disposed opposite the first area, a contact frame including first and second contact members respectively coupled to the first and second contact features for signal communication between the first and second contact features and an external electronic device, and a housing enclosing an interior region of the microchip and carrying the first and second contact members of the contact frame.
Type:
Grant
Filed:
May 17, 2019
Date of Patent:
May 4, 2021
Assignees:
Saudi Arabian Oil Company, Yu Technologies, Inc.
Inventors:
Bodong Li, Chinthaka Pasan Gooneratne, Guodong Zhan, Zhaorui Shi