Abstract: Compositions for floor polish. Specifically, a composition for floor polish made by the two-step process including the steps of (1) providing water-borne polyurethane resin, preferably having 2-20 acid functional groups per urethane and having an acid value of 15-200 and a molecular weight of 10,000 to 1,000,000, and (2) reacting the polyurethane resin with a calcium compound, not complexed with amines or ammonia, in an amount sufficient to form 0.05 to 0.9 chemical equivalents of calcium crosslinkages relative to the acid functional groups of the polyurethane resin. The invention also includes a floor polish made by a three-step process including the steps of (1) providing an emulsion of a water-borne polyurethane resin as described above, (2) adjusting the pH of the emulsion to a pH value within the range of 4.5 to 9 by adding a base to the emulsion, and (3) reacting the water-borne polyurethane resin with a calcium compound as described above.
Abstract: A process for preparing a coating composition characterized in that the process comprises the step of reacting 0.05 to 0.9 chemical equivalents of a calcium compound based on an acid value of a polymer with a polymer emulsion containing the polymer having the acid value of 20 to 200 prepared by a polymerization of unsaturated ethylenic monomers is provided. Calcium oxide, calcium hydroxide, calcium carbonate and the like may be used as the calcium compound, and the reaction of the calcium compound with the polymer may be carried out after the pH of the emulsion is adjusted within a range of from 4.5 to 9 by adding a base. The coating compositions of the present invention are stable for long period of time and free from environmental pollution since they contain no heavy metal. They are characterized to not generate uncomfortable odor of ammonia during application and drying-up since no metal complex is used.
Abstract: An additive contains a silicone resin as a deactivation agent which functions at soldering temperature. This novel additive is used for fluxes and soldering pastes. In the course of soldering, the silicone resin in the additive deactivates an activator such as organic acids contained in the flux and the soldering paste in order for removal of an oxide film from a metallic base used for electric circuit. By use of the additive, corrosion of the metallic base with the activator is protected even though the activator remains on the base. The additive enables to omit an unnecessary washing step from a preparation of electric circiut.
Abstract: An additive contains a deactivation agent functioning at soldering temperature. This novel additive is used for fluxes and soldering pastes. In the course of soldering, the deactivation agent in the additive deactivates an activator such as organic acids contained in the flux and the soldering paste in order for removal of an oxide film from a metallic base used for electric circuit. By use of the additive, corrosion of the metallic base with the activator is prevented even though the activator remains on the base. The additive enables one to omit an unnecessary washing step from a preparation of electric circuit.
Abstract: Removable water-borne urethane resin coating composition comprising polyurethane resin containing carboxyl groups and/or carboxylate groups and polyvalent metal complex as a cross-linking agent and method for removing the coating formed by using the removable water-borne urethane resin coating composition which comprises treating said coating with a ligand containing alkaline solution and removing the coating.The coating formed by using the composition is superior in water resistance, recoatability, detergent resistance, black heel mark resistance, abrasion resistance and service life.
November 6, 1985
Date of Patent:
November 11, 1986
Yuho Chemicals Inc., Mitsui Toatsu Chemical Inc.
Tadashi Gomi, Kenji Sakata, Ichiro Aoyama, Nobuo Sono
Abstract: A powdered cleaning composition comprising a carrier comprised of an organic fiber having a length of from 110 to 1000 microns and an amino-aldehyde resin, and adsorbed in said carrier at least one surfactant and water, is disclosed.
September 27, 1982
Date of Patent:
April 3, 1984
Fuji Kasei Co., Ltd., Yuho Chemicals Inc.