Abstract: To provide a spiral contactor 1 characterized as comprising of making an electrical connection with semiconductor devices or electronic parts having solder balls, and equipping with a spiral probe 2 having a spiral shape seen in top view to connect with raised solder balls as ductility in response to the shape of this spiral probe when connecting with this solder probe on the insulting substrate, A spiral contactor, a semiconductor inspection device (test socket, test board, Probe card) and electronic parts (mounting socket, mounting connector) which are capable for responding to from small semiconductor devices to packages, super smaller bear chips, moreover, to wafer also, forming carry-current circuits without causing a soft solder probe to deform or flaw, and capable for corresponding to densification of solder probes and realistic for reasonable price and high reliable inspection, can be provided.
Type:
Application
Filed:
October 21, 2002
Publication date:
March 27, 2003
Applicant:
Yukihiro HIRAI
Inventors:
Yukihiro Hirai, Chihiro Ueda, Kouichi Yoshida