Patents Assigned to Yulim Hitech, Inc.
  • Patent number: 7014499
    Abstract: A probe card for testing semiconductor devices includes a main board member, an upper reinforcing plate, a lower reinforcing plate, an interface member, a sub board member, a needle guide member, a needle member, a side cover member, and a clamping member. The probe card achieves an interface between the circuit boards through elastic connection pins so as to cope with a connection shock with the connection terminals of a semiconductor device, thereby preventing damages on the boards, and has the component parts combined together simply by face contacts to facilitate assembly and disassembly of the component parts and thereby to provide a great economical advantage in the aspect of maintenance and repair.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: March 21, 2006
    Assignee: Yulim Hitech, Inc.
    Inventor: Soo Yoon
  • Publication number: 20060003625
    Abstract: A probe card for testing semiconductor devices includes a main board member, an upper reinforcing plate, a lower reinforcing plate, an interface member, a sub board member, a needle guide member, a needle member, a side cover member, and a clamping member. The probe card achieves an interface between the circuit boards through elastic connection pins so as to cope with a connection shock with the connection terminals of a semiconductor device, thereby preventing damages on the boards, and has the component parts combined together simply by face contacts to facilitate assembly and disassembly of the component parts and thereby to provide a great economical advantage in the aspect of maintenance and repair.
    Type: Application
    Filed: February 15, 2005
    Publication date: January 5, 2006
    Applicant: YULIM HITECH, INC.
    Inventor: Soo Yoon
  • Patent number: 6922069
    Abstract: A needle assembly of probe card includes a plate and needles formed therein for enhancing an assembly characteristic and productivity and increasing an exact and reliable characteristic test. The plate is provided with holes that are formed with an insulating film on an inner side surface thereof. One side end surface of the needle adheres on an inner side surface of the hole, another side end surface thereof is spaced from an inner side surface of the hole, and a vertical thickness of the other side of the hole is formed thinner than the plate so as to have a space in which the other side can vertically move upwardly and downwardly. The plate and the needle are integrated.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: July 26, 2005
    Assignee: Yulim Hitech, Inc.
    Inventor: Tae-Un Jun
  • Publication number: 20040201389
    Abstract: A needle assembly of probe card includes a needle guide plate and needle plates formed therein for enhancing an assembly characteristic and a productivity and increasing an exact and reliable characteristic test. The needle guide plate is provided with needle movable holes that are formed with an insulating film on a circumferential surface thereof. One side end surface of the needle plate adheres on an inner side surface of the needle movable hole, another side end surface thereof is spaced from a circumferential surface of the needle movable hole, and a vertical thickness of the other side of the needle movable hole is formed thinner than the needle guide plate so as to have a space in which the other side can vertically move upward and downward. The needle guide plate and the needle plate are combined into one body.
    Type: Application
    Filed: December 19, 2003
    Publication date: October 14, 2004
    Applicant: YULIM HITECH, INC.
    Inventor: Tae-Un Jun