Patents Assigned to Zaonzi Co., Ltd.
  • Patent number: 8773855
    Abstract: A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion, which is thermally coupled to the radiator, and a heat-dissipating portion, which releases heat absorbed from the heat-receiving portion.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: July 8, 2014
    Assignee: Zaonzi Co., Ltd.
    Inventor: Sang-Cheol Lee
  • Publication number: 20140166239
    Abstract: There is provided a heat dissipating device using a heat pipe. The heat dissipating device includes a plurality of unit pipe loops. Each unit pipe loop includes: a heat absorbing part arranged adjacent to a heat source; and a heat dissipating part which is connected with the heat absorbing part and dissipates heat transferred from the heat absorbing part. A working fluid is to be provided inside the heat absorbing part and the heat dissipating part. The plurality of unit pipe loops being arranged radially with respect to the heat source.
    Type: Application
    Filed: February 26, 2014
    Publication date: June 19, 2014
    Applicant: Zaonzi Co., Ltd.
    Inventor: Sangcheol Lee
  • Publication number: 20120063092
    Abstract: A heat-dissipating device and an electronic apparatus having the same are disclosed. The heat-dissipating device includes a heat-transferring heat pipe unit having a wick type of a heat pipe, in which a wick is formed on an inner surface of the heat pipe and a working fluid is injected into the heat pipe, and a heat-dissipating heat pipe unit having an oscillating capillary type of a loop heat pipe, in which the loop heat pipe is formed as a capillary and a working fluid is injected into the loop heat pipe. Here, the heat pipe includes a radiator being disposed adjacent to a heat source and transporting heat transferred from the heat source to the loop heat pipe, and the loop heat pipe includes a heat-receiving portion, which is thermally coupled to the radiator, and a heat-dissipating portion, which releases heat absorbed from the heat-receiving portion.
    Type: Application
    Filed: November 21, 2011
    Publication date: March 15, 2012
    Applicant: ZAONZI CO., LTD.
    Inventor: Sang Cheol Lee
  • Patent number: D677636
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: March 12, 2013
    Assignee: Zaonzi Co., Ltd.
    Inventor: Sangcheol Lee