Abstract: An integrated circuit package socket of a "low profile" construction having a built-in anti-wicking feature and arranged to accept leads of varying widths without overstressing.
Type:
Grant
Filed:
September 2, 1975
Date of Patent:
July 5, 1977
Assignee:
Zero Manufacturing Company
Inventors:
Eugene G. Freehauf, Gene C. Hollingsworth, David Edward Welsh