Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

Abstract: A method for detecting defects includes directing a scanning beam to a location on a surface of a transparent sample, measuring top and bottom surface specular reflection intensity, and storing coordinate values of the first location and the top and bottom surface specular reflection intensity in a memory. The method may further include comparing the top surface specular reflection intensity measured at each location with a first threshold value, comparing the bottom surface specular reflection intensity measured at each location with a second threshold value, and determining if a defect is present at each location and on which surface the defect is present. The method may further include comparing the top surface specular reflection intensity measured at each location with a first intensity range, comparing the bottom surface specular reflection intensity measured at each location with a second intensity range, and determining on which surface the defect is present.

Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.

Abstract: A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.

Abstract: A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.

Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.

Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.

Abstract: A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.

Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second lens, a field stop, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The first lens focuses scattered radiation from the sample to generate multiple scan lines at a first focal plane. The field stop is positioned at the first focal plane to block one or more scan lines at the first focal plane. The scan line not blocked by the field stop propagates to the second lens. The second lens de-scans the scan line and generates a point of scattered radiation at a second focal plane where the detector input is located.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second waveplate, a polarizing beam splitter, a first detector, a focusing lens, a blocker, and a second detector. The radiating source irradiates the first waveplate generating circularly polarized source beam that irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. Reflected radiation from a sample is directed to the second waveplate generating linearly polarized beam that irradiates the polarizing beam splitter which directs a portion of the reflected radiation to the first detector. Scattered radiation from the sample is directed by the focusing lens to the second detector. Contemporaneous measurements by the first and second detectors are compared to differentiate.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second waveplate, a polarizing beam splitter, a first detector, a focusing lens, a blocker, and a second detector. The radiating source irradiates the first waveplate generating circularly polarized source beam that irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. Reflected radiation from a sample is directed to the second waveplate generating linearly polarized beam that irradiates the polarizing beam splitter which directs a portion of the reflected radiation to the first detector. Scattered radiation from the sample is directed by the focusing lens to the second detector. Contemporaneous measurements by the first and second detectors are compared to differentiate.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a blocker, a focusing lens, an aperture, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a transparent sample. A portion of the source beam travels through the transparent sample to another surface. The blocker blocks scattered radiation originating at the other surface. Scattered radiation originating from the transparent sample is not redirected by the blocker and is focused by the focusing lens to a first focal plane. The focused scattered radiation passes through the aperture before irradiating the detector. The detector output an intensity measurement of the scattered radiation that irradiates the detector.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a separating mirror, and a first and second detector. The radiating source is configured to irradiate a first position on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The telecentric scan lens directs specular reflection and near specular scattered radiation to the time varying beam reflector. The specular reflection is directed by the separating mirror to the first detector. The near specular scattered radiation is not reflected by the separating mirror and propagates to the second detector. In response, the optical inspector determines the total reflectivity, the surface slope, or the near specular scattered radiation intensity of the sample.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first waveplate, a second waveplate, a polarizing beam splitter, and a detector. The radiating source irradiates the first waveplate with a linearly polarized source beam generating a circularly polarized source beam, which irradiates a first position of on the time varying beam reflector. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a transparent sample. The reflected radiation from the transparent sample is directed via the telecentric lens and the time varying beam reflector to the second waveplate, which converts circularly polarized reflected radiation to linearly polarized reflected radiation including radiation that is vertically polarized and radiation that is horizontally polarized.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a separating minor, and a first and second detector. The radiating source is configured to irradiate a first position on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The telecentric scan lens directs specular reflection and near specular scattered radiation to the time varying beam reflector. The specular reflection is directed by the separating mirror to the first detector. The near specular scattered radiation is not reflected by the separating minor and propagates to the second detector. In response, the optical inspector determines the total reflectivity, the surface slope, or the near specular scattered radiation intensity of the sample.

Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second lens, a field stop, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The first lens focuses scattered radiation from the sample to generate multiple scan lines at a first focal plane. The field stop is positioned at the first focal plane to block one or more scan lines at the first focal plane. The scan line not blocked by the field stop propagates to the second lens. The second lens de-scans the scan line and generates a point of scattered radiation at a second focal plane where the detector input is located.

Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.

Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

Abstract: A compact and low cost microscope illuminator capable of generating 3-D optical images includes a first light source and a second light source. The two light sources lead two optical paths: one to illuminate a sample and another to project a pattern onto the focal plane of a microscope objective lens. The two light sources are controlled by a processor and can be turned on and off rapidly. A 3-D optical microscope equipped with said microscope illuminator and a method of creating a 3-D image on said 3-D optical microscope are also described.