Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: The disclosure provides methods for expanding a polymeric tube using one or more deformable members. The methods can involve disposing the polymeric tube within the one or more deformable members and radially deforming the polymeric tube and the one or more deformable members. The rate of deformation of the polymeric tube and/or the extent of deformation of the one or more polymeric tubes can advantageously be controlled along one or more axes by at least one of the one or more deformable members.

Abstract: A wafer processing apparatus of the present invention includes a first chamber unit in which a first wafer part including a retainer ring portion and a plurality of sawn first dies is processed, a second chamber unit in which a second wafer part including a wafer part or a carrier substrate is processed, and a third chamber unit in which the first dies of the first wafer part processed in the first chamber unit and the second wafer part processed in the second chamber unit are stacked and pre-bonded.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

Abstract: The disclosure provides tubes including a blend of two or more polyethylenes. For example, the blend can comprise at least 80% by weight of one or more of LLDPE, LDPE, MDPE, and HDPE, and no more than 20% by weight of UHMWPE. Such tubes can have low average wall thicknesses, e.g., 0.1 mm or less, rendering them suitable for use as catheter liners.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: The disclosure relates to assemblies of thin-walled tubes and mandrels for use in thin wall catheter liners. For example, an assembly is provided that includes a thin-walled PTFE tube comprising walls with a thickness of less than 0.004 inches, positioned over a filled mandrel comprising PTFE with one or more fillers incorporated therein. The disclosure further provides, independently, thin-walled tubes and filled mandrels, as well as methods of making and using such components.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Abstract: A computer-implemented method for selectively providing access to medical record information is disclosed. The method includes receiving, at a computer system, one or more digital images of a healthcare patient from a computing device that corresponds to a user account that is authorized to obtain information about patients in a healthcare system; using computerized facial recognition to identify the person as being one or more registered members of the healthcare system and to obtain a member identifier; using the member identifier to obtain electronic medical record information about the person; and providing some or all of the obtained electronic medical record information to the computing device.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: An actuator module is provided. The actuator module includes a motor part including a drive shaft and a drive part configured to rotate the drive shaft, a reducer installed on one side of the drive part and configured to increase an output torque according to driving of the motor part, a brake installed on an opposite side of the drive part and configured to suppress rotation of the motor part, an encoder installed on one side of the brake and configured to sense an operation of the drive shaft, a controller installed on one side of the encoder and electrically connected to the motor part to control the motor part, and a first housing configured to surround the motor part, the reducer, the brake, the encoder and the controller. An airflow path through which an airflow can flow is formed to extend from the motor part.

Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.

Abstract: The present disclosure provides a dual layer heat shrink tube having: an inner polymeric layer with a thickness t1 and an outer diameter D1; and an outer, expanded polymeric layer with a thickness t2? and an outer diameter D2? obtained by expanding a polymer tube from D2 to D2? and t2 to t2? at a selected temperature so that D2??2(t2?)>D1, wherein a ring cut from a cross-section of the dual layer heat shrink tube, slit into a rectangle and gripped at cut ends by tension grips within a DMA, and subjected to a temperature sweep of 3° C./min at a frequency of 1 Hz from the onset of a melting endotherm of the inner polymeric layer to that of the outer, expanded polymeric layer is greater than 1° C. and less than 12° C. The disclosure further provides associated methods for preparing and using such tubes, as well as to products comprising such tubes.

Abstract: A universal chassis frame is disclosed having a ladder-frame construction configurable to position a rear axle(s) at variable distances from a back of a vehicle's cab to provide customized rail/bed lengths for different electric truck classes. The chassis frame includes a central frame having a pair of main frame rails to support at least two battery modules substantially within an intra-frame space. A front subframe supports the cab, a front portion including a pair of upper frame members mounted above the corresponding main frame rails, and a front axle unit mounted under the front subframe. A rear subframe supports at least one rear axle unit mounted under the rear subframe and any of multiple configurable rear payload units via a common connection interface affixable to the main frame rails so the rear subframe's location with respect to the main frame is longitudinally variable from the back of the cab.

Abstract: Methods for preparing oriented polymer tubes, such as biodegradable polymer tubes suitable for in vivo use, are provided herein. The disclosed methods provide alternatives to the typical extrusion/expansion methods by which oriented polymeric tubes for such uses are commonly produced. Advantageously, the disclosed methods can provide more homogeneous molecular orientation of crystallizable polymers within the tube walls, which can endow such polymeric tubes with enhanced strength (e.g., resistance to compression) and toughness.

Abstract: The present application relates generally to tubes, such as thin walled catheter liners with small wall thicknesses (e.g., less than 1 mm), including crosslinked fluoropolymers, e.g., crosslinked poly(tetrafluoroethylene). The disclosure further provides methods of manufacturing such tubes and systems for manufacturing such tubes.

Abstract: A non-crosslinked polymeric heat shrink tubing including poly(ether-block-amide) (PEBA) and methods for making such non-crosslinked polymeric heat shrink tubing is provided. The non-crosslinked PEBA heat shrink tubing disclosed herein finds application, e.g., as a processing aid and final component in the manufacture of catheters and other medical devices.

Abstract: The present disclosure provides poly(tetrafluoroethylene) (PTFE) microparticles with a Dv50 of about 20 ?m to about 30 mm and a specific surface area (SSA) of at least about 3.0 m2/g when measured by a multipoint BET method of ISO 9277. Such PTFE microparticles can be obtained via a method including thermomechanically degrading scrap PTFE in the presence of air and/or oxygen and reducing the particle size of the resultant degraded PTFE.

Abstract: The present disclosure provides extruded PTFE composite tubes with a reduced coefficient of friction (COF). In some embodiments, such extruded PTFE composite tubes may exhibit a reduced change in coefficient of friction between about 20° C. and about 40° C. with the inclusion of secondary polymeric particles with small particle sizes (<100 ?m) at loading percentages of less than about 50 weight %.