Abstract: The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.
Type:
Grant
Filed:
July 10, 2020
Date of Patent:
November 28, 2023
Assignee:
Zhejiang First Advanced Material R&D Institute Co., Ltd.