Patents Assigned to Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
  • Chip package
    Patent number: 9779940
    Abstract: An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: October 3, 2017
    Assignee: Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
    Inventors: Dror Hurwitz, Alex Huang