Patents Assigned to Zhuhai Advanced Chiip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
  • Thin Film Capacitors Embedded in Polymer Dielectric
    Publication number: 20150043126
    Abstract: A substrate comprising a capacitor comprising metal electrodes and a ceramic or metal oxide dielectric layer, the capacitor being embedded in a polymer based encapsulating material and connectable to a circuit via a via post standing on said capacitor.
    Type: Application
    Filed: August 8, 2013
    Publication date: February 12, 2015
    Applicant: Zhuhai Advanced Chiip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
    Inventors: Dror Hurwitz, Alex Huang