Patents Assigned to Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.
  • Single Layer Coreless Substrate
    Publication number: 20140167234
    Abstract: An electronic chip package comprising at least one chip bonded to a routing layer of an interposer comprising a routing layer and a via post layer that is surrounded by a dielectric material comprising glass fibers in a polymer matrix, wherein the electronic chip package further comprises a second layer of a dielectric material encapsulating the at least one chip, the routing layer and the wires, and methods of fabricating such electronic chip packages.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.
    Inventor: Zhuhai Advanced Chip Carriers & Electronic Substrate Technologies Co. Ltd.