Patents Assigned to ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD.
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Patent number: 9900978Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.Type: GrantFiled: October 29, 2012Date of Patent: February 20, 2018Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder PCB Development Co., Ltd., Chongqing Founder Hi-Tech Electronic Inc.Inventors: Xinhong Su, George Dudnikov, Jr., Shuhan Shi
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Patent number: 9185808Abstract: The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.Type: GrantFiled: December 14, 2012Date of Patent: November 10, 2015Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd., Zhuhai Founder PCB Development Co., Ltd.Inventors: Lanyuan Chen, Haode Li
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Patent number: 9101084Abstract: A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.Type: GrantFiled: December 31, 2012Date of Patent: August 4, 2015Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder Tech. Multilayer PCB Co., Ltd., Zhuhai Founder PCB Development Co., Ltd.Inventor: Yansheng Hua
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Publication number: 20150041191Abstract: A printed circuit board and a preparation method thereof. The preparation method includes: making a first through hole in a core board including a metal layer; filling copper into the first through hole; forming a circuit pattern of the metal layer of the core board through an alkaline etching process; successively laminating a dielectric layer and a first copper foil on one side of the core board; making a second through hole opposite to and communicated with the first through hole, in the first copper foil; filling copper into the second through hole; and forming a circuit pattern of the first copper foil. The method for preparing the printed circuit board provided in the present invention can effectively reduce the preparation cost of the printed circuit board, greatly increase the yield of a product and further improve the universality of application.Type: ApplicationFiled: November 27, 2013Publication date: February 12, 2015Applicants: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., FOUNDER INFORMATION INDUSTRY HOLDINGS CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD., ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LT D.Inventors: Feng LIU, Xinxing HU
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Publication number: 20140190733Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.Type: ApplicationFiled: October 29, 2012Publication date: July 10, 2014Applicants: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD., CHONGQING FOUNDER HI-TECH ELECTRONIC INC.Inventors: George Dudnikov, JR., Xinhong Su, Shuhan Shi
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Publication number: 20130186674Abstract: Embodiments of the present disclosure relate to the field of printed circuit boards and particularly to a multi-layer printed circuit board. The multi-layer printed circuit board includes at least two inner-layer circuit boards, each of which has a non-circuit pattern area including a welding area. Each welding area has at least one welding hole. Further, at least one prepreg is used to fill between two adjacent inner-layer circuit boards and is melted to fill into the welding hole in a welding process. In the multi-layer printed circuit board according to the embodiments of the disclosure, a welding area is arranged in a non-circuit pattern area, and one or more welding holes are arranged in the welding area so that a prepreg between two inner-layer circuit boards can be melted filling into the welding hole(s) in a welding process, thus enhancing effectively an adhesive force binding the inner-layer circuit boards.Type: ApplicationFiled: December 17, 2012Publication date: July 25, 2013Applicants: Peking University Founder Group Co., Ltd., Zhuhai Founder PCB Development Co., Ltd., Chongqing founder Hi-Tech Electronic Inc.Inventors: Peking University Founder Group Co., Ltd., Chongqing founder Hi-Tech Electronic Inc., Zhuhai Founder PCB Development Co., Ltd.
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Publication number: 20130180761Abstract: The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.Type: ApplicationFiled: December 14, 2012Publication date: July 18, 2013Applicants: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD., ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD.Inventors: Peking University Founder Group Co., Ltd., Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd., Zhuhai Founder PCB Development Co., Ltd.
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Publication number: 20130168137Abstract: A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.Type: ApplicationFiled: December 31, 2012Publication date: July 4, 2013Applicants: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD., ZHUHAI FOUNDER TECH. MULTILAYER PCB CO., LTD.Inventors: Peking Unicersity Founder Group Co., Ltd., Zhuhai Founder Tech. Multilayer PCB Co., Ltd., Zhuhai Founder PCB Development Co., Ltd.
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Publication number: 20130168314Abstract: Disclosed is a method for treating wastewater containing at least one copper complex, comprising: 1) providing the wastewater containing the at least one copper complex, wherein the at least one copper complex is chosen from EDTA-Cu2+ complex and ammonia-Cu2+ complex; 2) adjusting pH of the wastewater containing the at least one copper complex to be within a range from 2.0 to 3.0, and adding ferrous sulfate to convert copper in the wastewater into a form of cuprous ions; and 3) adjusting pH of the wastewater obtained in step 2) to be within a range from 8.0 to 10.5, so that the cuprous ions in the wastewater are converted into precipitates of cuprous hydroxide and/or precipitates of cuprous oxide.Type: ApplicationFiled: December 28, 2012Publication date: July 4, 2013Applicants: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD., ZHUHAI FOUNDER TECH. MULTILAYER PCB CO., LTD.Inventors: PEKING UNIVERSITY FOUNDER GROUP CO. LTD., ZHUHAI FOUNDER TECH. MULTILAYER PCB CO., LTD., ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD.