Abstract: The present invention relates to a polyester resin composition, a preparation method thereof and use thereof. The polyester resin composition includes a PCT resin, a white pigment, a reinforcing material, a polyester elastomer, and other additives. The polyester resin composition provided by the present invention has a strong binding force with a silica gel; when the polyester resin composition is made into an LED reflecting support, the LED reflecting support is not easy to separate from the silica gel in high temperature and high humidity environments, such that the service life of an LED lamp bead can be effectively prolonged; and meanwhile, the polyester resin composition has good toughness, and would not cause the problem of powder falling under repeated stress.

Abstract: The present invention provides a PA10T molding composite material that can be used to produce LED display light source reflection supports. The width of the crystallization peak at half maximum ?T1/2 is adjusted to be 3-10° C., the whiteness is adjusted to be less than 26, and the 460 nm light source reflectivity is adjusted to be less than 6.5%, such that the PA 10T molding composite material has the advantages of low blue light, high contrast, and high gray scale, and can satisfy requirements for a packaging process and long-term reliability, and can be used as a packaging product to manufacture high-contrast LED display light source refection supports applicable in multiple scenarios.

Abstract: Disclosed is a furan diacid-based polyamide resin, which is derived from the following repeating units: (A) 2,5-furandicarboxylic acid, (B) 1,4-cyclohexanedicarboxylic acid, and (C) 1,10-decanediamine, where based on the total molar percentage of the diacid units, (A) accounts for 5-45 mol % of the diacid units.

Abstract: The present invention provides a semi-aromatic polyamide molding composite material that can be used for producing an LED display screen light source reflection support. Generally, by selecting a semi-aromatic polyamide resin having a specific repeating unit, and enabling the crystallization peak width at half maximum ?T1/2 to be 4-11° C., the whiteness to be less than 26.5, the reflectivity under a 460 nm light source to be less than 6% etc., the semi-aromatic polyamide molding composite material has the advantages of reduced blue light, high contrast ratio and high gray scale, and can meet requirements for the packaging process and long-term reliability. The package product can be used for manufacturing high-contrast LED display screen light source refection supports for use in multiple environments.

Abstract: The present invention discloses a furan diacid-based polyamide, which is derived from the following repeating units: (A) 2,5-furandicarboxylic acid, (B) 1,4-cyclohexanedicarboxylic acid, and (C) 1,5-pentanediamine, where based on the total molar percentage of the diacid units, (A) accounts for 10-45 mol % of the diacid units. The furan diacid-based polyamide of the present invention has a melting point of 291-335° C.

Abstract: A semiaromatic copolyamide resin and a polyamide molding composition consisting of the same are provided, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.

Abstract: The present invention discloses a semiaromatic copolyamide resin and a polyamide molding composition consisting of the same, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.

Abstract: The present invention discloses a semiaromatic polyamide resin, a preparation method thereof, and a polyamide molding composition consisting of the same, which consists of following components: (A) 20 to 95 wt % of a PA10T homopolymer derived from 1,10-decanediamine and terephthalic acid; and (B) 5 to 80 wt % of a PA6T homopolymer derived from 1,6-hexanediamine and terephthalic acid. Particularly, (A)+(B)=100 wt %. In the present invention, by adding a certain amount of the PA10T homopolymer into the PA6T homopolymer, a melting point of the PA6T homopolymer can be significantly decreased to be below a decomposition temperature thereof, and thereby a processability of the PA6T homopolymer is improved. The prepared semiaromatic polyamide resin has a decreased melting point, and may be processed normally. The polyamide molding composition consisting of the semiaromatic polyamide resin has a good processability, and has excellent surface properties.