Patents Assigned to Zilltek Technology Corp.
  • Patent number: 11856364
    Abstract: A microphone array system, comprises N microphones, including a first microphone . . . a Nth microphone, wherein N is a natural number greater than 2. Each of the N microphones is provided with: an acoustic transducer for picking up a sound signal and converting the sound signal into an electric signal; a voice activation detector, connected to a corresponding acoustic transducer, and configured to perform a voice activation detection on the electric signal and form an activation signal; a buffer memory, connected to the acoustic transducer, and configured to store a 1/N electric signal of a predetermined segment; a sound wire interface, connected to a corresponding acoustic transducer, the buffer memory, and the voice activation detector, wherein the sound wire interface is connected to an external master chip via a sound wire bus for outputting the activation signal to the external master chip.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: December 26, 2023
    Assignee: ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Patent number: 11849282
    Abstract: The invention relates to the technical field of microphones, in particular to an online trimmed MEMS microphone. The online trimmed MEMS microphone comprises an acoustic transducer for receiving an external ultrasonic signal and converting the ultrasonic signal into an electric signal; an ASIC (Application Specific Integrated Circuit) chip, coupled to the acoustic transducer, wherein the ASIC chip comprises: an amplifier unit for performing amplification on the electric signal and outputting an amplified signal; a decoding unit, connected to the amplifier unit, and configured to decode the amplified signal to obtain a decoded signal sequence; a matching unit, connected to the decoding unit, and configured to match the decoded signal sequence with a predetermined identification code to obtain a matched signal; a control unit, connected to the matching unit, and configured to generate one or more circuit adjusting parameters under the action of the matched signal.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: December 19, 2023
    Assignee: ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Publication number: 20230043176
    Abstract: A microphone array system, comprises N microphones, including a first microphone . . . a Nth microphone, wherein N is a natural number greater than 2. Each of the N microphones is provided with: an acoustic transducer for picking up a sound signal and converting the sound signal into an electric signal; a voice activation detector, connected to a corresponding acoustic transducer, and configured to perform a voice activation detection on the electric signal and form an activation signal; a buffer memory, connected to the acoustic transducer, and configured to store a 1/N electric signal of a predetermined segment; a sound wire interface, connected to a corresponding acoustic transducer, the buffer memory, and the voice activation detector, wherein the sound wire interface is connected to an external master chip via a sound wire bus for outputting the activation signal to the external master chip.
    Type: Application
    Filed: February 4, 2022
    Publication date: February 9, 2023
    Applicant: ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua YE
  • Publication number: 20230044905
    Abstract: The invention relates to the technical field of microphones, in particular to an online trimmed MEMS microphone. The online trimmed MEMS microphone comprises an acoustic transducer for receiving an external ultrasonic signal and converting the ultrasonic signal into an electric signal; an ASIC (Application Specific Integrated Circuit) chip, coupled to the acoustic transducer, wherein the ASIC chip comprises: an amplifier unit for performing amplification on the electric signal and outputting an amplified signal; a decoding unit, connected to the amplifier unit, and configured to decode the amplified signal to obtain a decoded signal sequence; a matching unit, connected to the decoding unit, and configured to match the decoded signal sequence with a predetermined identification code to obtain a matched signal; a control unit, connected to the matching unit, and configured to generate one or more circuit adjusting parameters under the action of the matched signal.
    Type: Application
    Filed: February 4, 2022
    Publication date: February 9, 2023
    Applicant: ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua YE
  • Patent number: 11039254
    Abstract: The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 15, 2021
    Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Publication number: 20200288250
    Abstract: The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.
    Type: Application
    Filed: October 23, 2019
    Publication date: September 10, 2020
    Applicants: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua YE
  • Publication number: 20200228887
    Abstract: The present invention relates to a microphone, and more particularly, to a microphone with a mechanical switch function. A microphone with a mechanical switch function according to the present invention comprises a microphone body, wherein the microphone body comprises a circuit substrate above which a metal cover is disposed, an acoustic cavity formed by the metal cover and the circuit substrate; and a metal elastic piece, wherein a gap is formed between the metal elastic piece and the metal cover, and the metal elastic piece electrically contacts with the metal cover under an effect of a pressing force. By adopting the above-mentioned technical solutions, the present invention provides a microphone with functions of a mechanical switch, and the new type of microphone occupies less space, has a lower cost and is convenient to use.
    Type: Application
    Filed: July 12, 2019
    Publication date: July 16, 2020
    Applicants: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Publication number: 20200178002
    Abstract: A MEMS microphone for a frame-free device, comprising a substrate, wherein the substrate comprises a first substrate region provided with an acoustic sensor, an ASIC chip, and a MEMS chip, and a second substrate region provided with a plurality of pads; both the first substrate region and the second substrate region are disposed at the same side of the substrate; an acoustic through-hole is disposed at the back of the first substrate region; a microphone connection structure further comprises a flexible circuit board, wherein the flexible circuit board electrically connects the plurality of pads of the MEMS microphone to a circuit board of the frame-free device; the acoustic through-hole is aligned with an acoustic opening of the frame-free device; by adopting the MEMS microphone for a frame-free device, the MEMS microphone may be more widely used in many high-tech industries and has better acoustic performance over the conventional MEMS microphone.
    Type: Application
    Filed: July 12, 2019
    Publication date: June 4, 2020
    Applicants: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua YE
  • Patent number: 10547924
    Abstract: The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: January 28, 2020
    Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Patent number: 10542349
    Abstract: The invention relates to the field of micro-electromechanical technology, and more particularly, to a microphone structure with an enhanced back cavity and an electronic device, comprising: a first layer plate, an groove is configured on the first layer plate, wherein an acoustic sensor is installed above the groove by means of a support, and the acoustic sensor is provided with a back cavity facing towards the support, and a through-hole for penetrating through the back cavity and the groove is provided on the support; a second layer plate, covering the first layer plate, wherein an acoustic through-hole is configured on the second layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 21, 2020
    Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Patent number: 10484799
    Abstract: A photoelectric MEMS microphone and an electronic device, have an acoustic cavity, the acoustic cavity includes a MEMS transducer, configured for capturing an acoustic signal, a signal processing chip, connected to a signal output terminal of the MEMS transducer. The signal processing chip includes a signal output terminal pin and a ground pin, and a light emitting device, a driving terminal of the light emitting device being connected to the signal output terminal pin. The light emitting device packaged in the microphone cavity provides the user indication that the microphone of the terminal device is turned on, avoiding the exposure of personal privacy. Furthermore, it helps to reduce costs in that the signal output terminal pin and the ground pin are integrated into the microphone.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: November 19, 2019
    Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Patent number: 10341769
    Abstract: A sound amplification system integrated with back cavity pressure sensing, including: a loudspeaker body, including: a vibrating diaphragm, a voice coil connected with the vibrating diaphragm, and a back cavity, wherein the voice coil is connected to a driving unit, a microphone is in the back cavity, and the microphone senses an internal pressure of the back cavity; a computing unit, making an estimation of a displacement of the vibrating diaphragm based on the internal pressure; and a processing unit, determining the displacement of the vibrating diaphragm when compared with a reference displacement, when it is determined that the displacement exceeds a set threshold, a pre-compensation signal is generated and provided to the driving unit.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: July 2, 2019
    Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.
    Inventor: Jinghua Ye
  • Patent number: 9326063
    Abstract: This present disclosure relates to the speech processing technology, more specifically, to a microphone. A microphone with voice wake-up function includes a microphone body with at least one transducer for collecting sound signals, a control module and a determining module. The microphone body is performed in a sleeping mode or an operating mode through the control module in accordance with the determined result. The invention enables the microphone body to switch between the sleeping mode and the operating mode. The sleeping mode reduces unnecessary power consumption and saves electrical energy. When a certain condition is satisfied, the body of the microphone is activated from the sleeping mode and enters into the normal operating mode.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: April 26, 2016
    Assignees: Shanghai Sniper Microelectronics Co. Ltd., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Patent number: 9226081
    Abstract: The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect when in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: December 29, 2015
    Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Publication number: 20150049884
    Abstract: This present disclosure relates to the speech processing technology, more specifically, to a microphone. A microphone with voice wake-up function includes a microphone body with at least one transducer for collecting sound signals, a control module and a determining module. The microphone body is performed in a sleeping mode or an operating mode through the control module in accordance with the determined result. The invention enables the microphone body to switch between the sleeping mode and the operating mode. The sleeping mode reduces unnecessary power consumption and saves electrical energy. When a certain condition is satisfied, the body of the microphone is activated from the sleeping mode and enters into the normal operating mode.
    Type: Application
    Filed: April 2, 2014
    Publication date: February 19, 2015
    Applicants: ZILLTEK TECHNOLOGY CORP., SHANGHAI SNIPER MICROELECTRONICS CO., LTD.
    Inventor: Jinghua Ye
  • Publication number: 20140353779
    Abstract: The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the MEMS microphone, which is used to output the electric signal generated by the microphone. The present invention avoids the sound air flow directly to the microphone chip, reduces dust interference on acoustic and electric sensor in microphone chip by means of changing the position of the sound hole of the microphone.
    Type: Application
    Filed: September 6, 2013
    Publication date: December 4, 2014
    Applicants: Zilltek Technology Corp., Shanghai Sniper Microelectronics Co., Ltd.
    Inventor: Jinghua YE