Patents Assigned to Zilltek Technology (Shanghai) Corp.
  • Patent number: 10542349
    Abstract: The invention relates to the field of micro-electromechanical technology, and more particularly, to a microphone structure with an enhanced back cavity and an electronic device, comprising: a first layer plate, an groove is configured on the first layer plate, wherein an acoustic sensor is installed above the groove by means of a support, and the acoustic sensor is provided with a back cavity facing towards the support, and a through-hole for penetrating through the back cavity and the groove is provided on the support; a second layer plate, covering the first layer plate, wherein an acoustic through-hole is configured on the second layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 21, 2020
    Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Patent number: 9326063
    Abstract: This present disclosure relates to the speech processing technology, more specifically, to a microphone. A microphone with voice wake-up function includes a microphone body with at least one transducer for collecting sound signals, a control module and a determining module. The microphone body is performed in a sleeping mode or an operating mode through the control module in accordance with the determined result. The invention enables the microphone body to switch between the sleeping mode and the operating mode. The sleeping mode reduces unnecessary power consumption and saves electrical energy. When a certain condition is satisfied, the body of the microphone is activated from the sleeping mode and enters into the normal operating mode.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: April 26, 2016
    Assignees: Shanghai Sniper Microelectronics Co. Ltd., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Patent number: 9226081
    Abstract: The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect when in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: December 29, 2015
    Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Publication number: 20140353779
    Abstract: The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the MEMS microphone, which is used to output the electric signal generated by the microphone. The present invention avoids the sound air flow directly to the microphone chip, reduces dust interference on acoustic and electric sensor in microphone chip by means of changing the position of the sound hole of the microphone.
    Type: Application
    Filed: September 6, 2013
    Publication date: December 4, 2014
    Applicants: Zilltek Technology Corp., Shanghai Sniper Microelectronics Co., Ltd.
    Inventor: Jinghua YE