Abstract: An evaporator device is provided, including a chamber including an inlet, an outlet, and a surface, the inlet being configured to direct a liquid coolant into the chamber and the outlet is configured to direct a vapor coolant away from the chamber, and the surface is in thermal communication with the liquid coolant or the vapor coolant, and a porous unit disposed adjacent to the surface, the porous unit being configured to (i) absorb the liquid coolant, (ii) bring the liquid coolant into thermal communication with the surface, (iii) subject the liquid coolant to a phase transition to a vapor coolant, and (iv) direct said vapor coolant away from the surface, wherein the surface and the porous unit are of different materials, and the porous unit is thermally insulating.

Abstract: The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.

Abstract: The present disclosure provides methods and systems for heat exchange, such as cooling a heat source. A cooling system of the present disclosure may comprise a first channel that is configured to direct a liquid coolant, a second channel that is configured to direct a vapor coolant generated from the liquid coolant, and a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant. The cooling system may further comprise at least one cooling interface in fluid communication with the first channel and the second channel. The cooling interface may be configured to facilitate heat exchange between the liquid coolant and a heat source.

Abstract: The present disclosure provides methods and systems for heat exchange, such as cooling a heat source. A cooling system of the present disclosure may comprise a first channel that is configured to direct a liquid coolant, a second channel that is configured to direct a vapor coolant generated from the liquid coolant, and a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant. The cooling system may further comprise at least one cooling interface in fluid communication with the first channel and the second channel. The cooling interface may be configured to facilitate heat exchange between the liquid coolant and a heat source.

Abstract: A thermal management system and method are presented for cooling an entity. The system comprises: a closed loop fluid flow line for flow of a coolant while being transferred in between its liquid and gas phases; at least one cooling zone located within the flow line and comprising at least one cooling interface; a vacuum generator unit operable for creating and maintaining vacuum condition at the cooling zone to thereby reduce evaporation temperature of the coolant located in the cooling zone; and a condensation zone spaced apart from the cooling interface downstream thereof with respect to a direction of the coolant flow from the cooling zone along the closed loop path wherein the coolant is condensed to liquid phase.